Email this article Up-to-date methods of quality control during electronic component mounting
- Authors: Kremlev K.1
-
Affiliations:
- ГК «Диполь»
- Issue: No 8 (2024)
- Pages: 74-78
- Section: Reliability and validation
- URL: https://journals.eco-vector.com/1992-4178/article/view/637268
- DOI: https://doi.org/10.22184/1992-4178.2024.239.8.74.78
- ID: 637268
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Abstract
The article reviews the various modern methods of testing used in the production of electronic products. It is noted that properly organized testing increases the economic efficiency of production and significantly reduces risks during electronic device manufacturing.
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About the authors
K. Kremlev
ГК «Диполь»
Author for correspondence.
Email: kremlev@dipaul.ru
Руководитель направления «Технологическое оборудование»
Russian FederationSupplementary files
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Fig. 1. Microcircuit defect detected by X-ray machine during incoming inspection
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Fig. 2. Example of a product defect due to a violation of production technology
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Fig. 3. Digital microscope for visual inspection Inspex HD 720p/HD 1080p manufactured by ASH Technologies
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Fig. 4. Zenith UHS Automatic Optical Inspection System
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Fig. 5. Industrial X-ray inspection system SRK-1000 manufactured by Dipol
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