电邮这篇文章 Up-to-date methods of quality control during electronic component mounting
- 作者: Kremlev K.1
-
隶属关系:
- ГК «Диполь»
- 期: 编号 8 (2024)
- 页面: 74-78
- 栏目: Reliability and validation
- URL: https://journals.eco-vector.com/1992-4178/article/view/637268
- DOI: https://doi.org/10.22184/1992-4178.2024.239.8.74.78
- ID: 637268
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详细
The article reviews the various modern methods of testing used in the production of electronic products. It is noted that properly organized testing increases the economic efficiency of production and significantly reduces risks during electronic device manufacturing.
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作者简介
K. Kremlev
ГК «Диполь»
编辑信件的主要联系方式.
Email: kremlev@dipaul.ru
Руководитель направления «Технологическое оборудование»
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Fig. 1. Microcircuit defect detected by X-ray machine during incoming inspection
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Fig. 2. Example of a product defect due to a violation of production technology
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Fig. 3. Digital microscope for visual inspection Inspex HD 720p/HD 1080p manufactured by ASH Technologies
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Fig. 4. Zenith UHS Automatic Optical Inspection System
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Fig. 5. Industrial X-ray inspection system SRK-1000 manufactured by Dipol
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