Enviar artigo por via de e-mail Up-to-date methods of quality control during electronic component mounting
- Autores: Kremlev K.1
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Afiliações:
- ГК «Диполь»
- Edição: Nº 8 (2024)
- Páginas: 74-78
- Seção: Reliability and validation
- URL: https://journals.eco-vector.com/1992-4178/article/view/637268
- DOI: https://doi.org/10.22184/1992-4178.2024.239.8.74.78
- ID: 637268
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Resumo
The article reviews the various modern methods of testing used in the production of electronic products. It is noted that properly organized testing increases the economic efficiency of production and significantly reduces risks during electronic device manufacturing.
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Sobre autores
K. Kremlev
ГК «Диполь»
Autor responsável pela correspondência
Email: kremlev@dipaul.ru
Руководитель направления «Технологическое оборудование»
RússiaArquivos suplementares
Arquivos suplementares
Ação
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JATS XML
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Fig. 1. Microcircuit defect detected by X-ray machine during incoming inspection
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Fig. 2. Example of a product defect due to a violation of production technology
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Fig. 3. Digital microscope for visual inspection Inspex HD 720p/HD 1080p manufactured by ASH Technologies
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Fig. 4. Zenith UHS Automatic Optical Inspection System
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Fig. 5. Industrial X-ray inspection system SRK-1000 manufactured by Dipol
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