Email this article Modern methods of removing contaminants from substrates in microelectronics
- Authors: Lelyaev V.1
-
Affiliations:
- Компания «Глобал Микроэлектроника»
- Issue: No 1 (2025)
- Pages: 64-68
- Section: Manufacturing technologies
- URL: https://journals.eco-vector.com/1992-4178/article/view/683091
- DOI: https://doi.org/10.22184/1992-4178.2025.242.1.64.68
- ID: 683091
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Abstract
The article discusses methods of liquid and dry cleaning of semiconductor substrates, features of the technological process and the equipment used.
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About the authors
V. Lelyaev
Компания «Глобал Микроэлектроника»
Author for correspondence.
Email: VL@global-micro.ru
руководитель направления
Russian FederationReferences
- Ефимов И.Е., Козырь И.Я., Горбунов Ю.И. Микроэлектроника. Физические и технологические основы. Надежность. М.: Высшая школа, 1986.
- Шмаков М., Паршин В., Смирнов А. Школа производства ГПИС. Очистка поверхности пластин и подложек // Технологии в электронной промышленности, 2008. № 5.
- Burkman D. Optimizing the cleaning procedure for silicon wafers prior to high temperature operations // Semiconductor International. 1981. V. 14. No. 14. Jul.
- Wood L., Fairfield C., Wang K. Plasma cleaning of chip scale packages for improvement of wire bond strength // Electronic Materials and Packaging, 2000. (EMAP 2000). International Symposium on. IEEE, 2000.
- Корочкин И., Хриченко В. Три кита плазменной очистки. Глобал Микроэлектроника, Москва, 2019.
- Yield engineering services / YES G500 User Manual.
Supplementary files
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Fig. 1. Methods of removing contaminants
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Fig. 2. Physical principle of ion (plasma) cleaning
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Fig. 3. Design of a cylindrical reactor
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Fig. 4. Construction of a chamber with movable electrode shelves
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Fig. 5. Electron-free mode
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Fig. 6. SH300 plasma cleaning unit from the Korean manufacturer H&J
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