Enviar artigo por via de e-mail Trends in the production of plastic package ICs
- Autores: Plis N.1, Rudakov V.1
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Afiliações:
- АО «Ангстрем»
- Edição: Nº 9 (230) (2023)
- Páginas: 100-109
- Seção: Design solutions
- URL: https://journals.eco-vector.com/1992-4178/article/view/633095
- DOI: https://doi.org/10.22184/1992-4178.2023.230.9.100.109
- ID: 633095
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Resumo
The article considers the evolution of the IC package domestic concept and the new requirements placed on it. A classification of IC packages according to the degree of tightness is proposed. From an analysis of IC production and application global practice, it follows that the future of the electronics industry lies in polymer package ICs.
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Sobre autores
N. Plis
АО «Ангстрем»
Autor responsável pela correspondência
Email: plis@angstrem.ru
к. т.н., первый заместитель генерального директора
RússiaV. Rudakov
АО «Ангстрем»
Email: valeryrudakov@rambler.ru
д.ф-м.н., ведущий специалист
RússiaBibliografia
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Fig. 1. Main functions of the microcircuit case [1]
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Fig. 2. Trends in IC mounting technology [13]
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Fig. 3. Evolution of the pin shape [14]. The apostrophe before the number means that it is perceived as a text symbol; the authors [14] use these symbols to show the scale in reducing the thickness of the microcircuit case. The brackets in the BGA mean the possibility in the future to reduce the thickness of the BGA case to the indicated symbolic size.
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Fig. 4. Main trends in sales of plastic cases [15]
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