Trends in the production of plastic package ICs

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The article considers the evolution of the IC package domestic concept and the new requirements placed on it. A classification of IC packages according to the degree of tightness is proposed. From an analysis of IC production and application global practice, it follows that the future of the electronics industry lies in polymer package ICs.

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作者简介

N. Plis

АО «Ангстрем»

编辑信件的主要联系方式.
Email: plis@angstrem.ru

к. т.н., первый заместитель генерального директора

俄罗斯联邦

V. Rudakov

АО «Ангстрем»

Email: valeryrudakov@rambler.ru

д.ф-м.н., ведущий специалист

俄罗斯联邦

参考

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2. Fig. 1. Main functions of the microcircuit case [1]

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3. Fig. 2. Trends in IC mounting technology [13]

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4. Fig. 3. Evolution of the pin shape [14]. The apostrophe before the number means that it is perceived as a text symbol; the authors [14] use these symbols to show the scale in reducing the thickness of the microcircuit case. The brackets in the BGA mean the possibility in the future to reduce the thickness of the BGA case to the indicated symbolic size.

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5. Fig. 4. Main trends in sales of plastic cases [15]

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