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Issue
Title
Authors
No 3 (2025)
Features and trends of the labor market in the electrical engineering industry in the Russian Federation
Artemyeva E.
PDF
(Rus)
No 7 (2025)
AOI from China for Russian production facilities
Shurov D.
PDF
(Rus)
No 6 (2023)
PAIRUI and HenLv: new brands at the russian market of voltage converters
Ezhov V.
PDF
(Rus)
No 10 (2024)
Use of domestic deep-calcined alumina for the production of metal-ceramic packages
Egoshin V., Shugaepov S., Akhmetgaliev R., Ermolaev E., Mazurenko A., Chernysheva Y.
PDF
(Rus)
No 5 (2023)
Development of leadless metal-ceramic packages for wide use in ZPP JSC
Ermilov R., Shugaepov S., Ermolaev Е., Egoshin V.
PDF
(Rus)
No 8 (2024)
The use of precision methods for electrical testing of metal-ceramic packages
Shugaepov S., Egoshin V., Ermolaev E., Taikov D.
PDF
(Rus)
No 3 (2024)
Artificial intelligence as a tool of improving the production process at «ZPP» JSC
Pozdeev V., Shugaepov S., Ermolaev E., Egoshin V.
PDF
(Rus)
No 4 (2024)
Metal-ceramic packages from “ZPP» JSC for RF and microwave devices
Shugaepov S., Ermolaev E., Egoshin V., Gluntsov A.
PDF
(Rus)
No 4 (2023)
New metal-ceramic packages from ZPP JSC
Shugaepov S., Ermolaev E., Egoshin V., Loskutova A., Sabirova E.
PDF
(Rus)
No 9 (2023)
Trends in the production of plastic package ICs
Plis N., Rudakov V.
PDF
(Rus)
No 2 (2024)
Improving the reliability characteristics of multi-lead metal-ceramic packages from ZPP JSC through the use of test systems
Ermilov R., Shugaepov S., Ermolaev E., Egoshin V.
PDF
(Rus)
No 3 (2023)
Equipment and materials for the manufacture of metal parts at ZPP JSC
Polyanin А., Shugaepov S., Ermolaev Е., Egoshin V.
PDF
(Rus)
No 6 (2023)
External factors resistance and reliability of metal-ceramic packages
Shugaepov S., Ermolaev E., Egoshin V., Sabirova E.
PDF
(Rus)
No 2 (2023)
Microbolometers vacuum packaging
Vidritsky A., Lanin V.
PDF
(Rus)
No 8 (2023)
Chiplets and heterogeneous integration as a basic technology stack capable of ensuring the sovereignty of domestic electronics in a new technological order
Achkasov A.
PDF
(Rus)
No 1 (2024)
Development of domestic CAD systems for microelectronics design based on the Delta Design platform
Malyshev N.
PDF
(Rus)
No 10 (2024)
Trends in packaging and assembly of discrete power components based on MOSFETs
Ivanov V., Sukhanov D.
PDF
(Rus)
No 8 (2023)
Incoming inspection of materials is the basis for the quality of metal-ceramic packages from ZPP JSC
Shugaepov S., Ermolaev E., Egoshin V., Khanina Y.
PDF
(Rus)
1 - 18 of 18 Items

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