Methodology for conducting incoming inspection of ICs in metal-ceramic packages
- Autores: Alontsev A.1
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Afiliações:
- АО «ТЕСТПРИБОР»
- Edição: Nº 8 (2024)
- Páginas: 68-69
- Seção: Test and measurement
- URL: https://journals.eco-vector.com/1992-4178/article/view/637266
- DOI: https://doi.org/10.22184/1992-4178.2024.239.8.68.69
- ID: 637266
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Resumo
The article examines the resources and competencies required to conduct incoming inspection of ICs in metal-ceramic packages, as well as the difficulties that arise when inspecting foreign-made packages associated with the need to focus on foreign standards.
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Sobre autores
A. Alontsev
АО «ТЕСТПРИБОР»
Autor responsável pela correspondência
Email: kys@electronics.ru
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