Мақаланы E-mail арқылы жіберу Some aspects of the development of IC testing and verification methodologies
- Авторлар: Makushin M.1
-
Мекемелер:
- НОБ «Военные науки и оборонная промышленность» БРЭ
- Шығарылым: № 8 (2025)
- Беттер: 30-40
- Бөлім: Test and measurement
- URL: https://journals.eco-vector.com/1992-4178/article/view/695959
- DOI: https://doi.org/10.22184/1992-4178.2025.250.8.30.40
- ID: 695959
Дәйексөз келтіру
Ашық рұқсат
Рұқсат берілді
Аннотация
With the adoption of ever smaller design rules, the increasing use of 3D designs and heterogenous (with diverse design rules and functionality) multi-chip/multi-chiplet modules, the need for new verification methods arises.
Негізгі сөздер
Толық мәтін
Авторлар туралы
M. Makushin
НОБ «Военные науки и оборонная промышленность» БРЭ
Хат алмасуға жауапты Автор.
Email: journal@electronics.ru
ведущий научный редактор
РесейӘдебиет тізімі
- Bailey B. Improving Verification Methodologies // Semiconductor Engineering. 2025. February 27ʰᵗ.
- Peters L. Making The Most of Test Resources // Semiconductor Engineering. 2025. September 9ʰᵗ.
- Foster H. How AI And Connected Workflows Will Close The Verification Bottleneck // Semiconductor Engineering. 2025. March 27ʰᵗ.
- Peters L. Automation And AI Improve Failure Analysis // Semiconductor Engineering. 2025. March 11ʰᵗ.
- Haley G. E-Beam Inspection Proves Essential For Advanced Nodes // Semiconductor Engineering. 2025. May 8ʰᵗ.
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Әрекет
1.
JATS XML
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Fig. 1. Errors identified at each stage of development.
Жүктеу (481KB)
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Fig. 2. The number of successful IS creation projects is declining.
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Fig. 3. Locations of hidden defects on the wafer, detected by electron beam inspection tools with a resolution of 5 nm.
Жүктеу (1MB)
