电邮这篇文章 Technologies and equipment for temporary and permanent bonding of semiconductor wafers
- 作者: Mandrik I.1, Novozhilov I.1
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隶属关系:
- ГК «Диполь»
- 期: 编号 7 (2024)
- 页面: 176-181
- 栏目: Manufacturing technologies
- URL: https://journals.eco-vector.com/1992-4178/article/view/636200
- DOI: https://doi.org/10.22184/1992-4178.2024.238.7.176.181
- ID: 636200
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详细
Wafer bonding technology is increasingly used in areas such as 3D integration, packaging, ultra-thin electronic devices, and MEMS. The article provides an overview of wafer bonding technologies, discusses the key requirements and process parameters, and the equipment used.
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作者简介
I. Mandrik
ГК «Диполь»
编辑信件的主要联系方式.
Email: MandrikIV@dipaul.ru
к. т. н., руководитель проектов
俄罗斯联邦I. Novozhilov
ГК «Диполь»
Email: NovozhilovIA@dipaul.ru
руководитель направления «Микроэлектроника»
俄罗斯联邦补充文件
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JATS XML
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Fig. 1. Classification of wafer bonding technologies in microelectronics
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Fig. 2. Plate splicing process without intermediate layer
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Fig. 3. Bonding process of semiconductor wafers with an intermediate layer
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Fig. 4. Metal plate bonding: a - thermocompression bonding; b - eutectic bonding
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Fig. 5. Temporary splicing unit SBN-12
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Fig. 6. Debonding unit SDN-08
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Fig. 7. SPB-08 direct splicing machine
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