Email this article Technologies and equipment for temporary and permanent bonding of semiconductor wafers
- Authors: Mandrik I.1, Novozhilov I.1
-
Affiliations:
- ГК «Диполь»
- Issue: No 7 (2024)
- Pages: 176-181
- Section: Manufacturing technologies
- URL: https://journals.eco-vector.com/1992-4178/article/view/636200
- DOI: https://doi.org/10.22184/1992-4178.2024.238.7.176.181
- ID: 636200
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Abstract
Wafer bonding technology is increasingly used in areas such as 3D integration, packaging, ultra-thin electronic devices, and MEMS. The article provides an overview of wafer bonding technologies, discusses the key requirements and process parameters, and the equipment used.
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About the authors
I. Mandrik
ГК «Диполь»
Author for correspondence.
Email: MandrikIV@dipaul.ru
к. т. н., руководитель проектов
Russian FederationI. Novozhilov
ГК «Диполь»
Email: NovozhilovIA@dipaul.ru
руководитель направления «Микроэлектроника»
Russian FederationSupplementary files
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Fig. 1. Classification of wafer bonding technologies in microelectronics
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Fig. 2. Plate splicing process without intermediate layer
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Fig. 3. Bonding process of semiconductor wafers with an intermediate layer
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Fig. 4. Metal plate bonding: a - thermocompression bonding; b - eutectic bonding
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Fig. 5. Temporary splicing unit SBN-12
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Fig. 6. Debonding unit SDN-08
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Fig. 7. SPB-08 direct splicing machine
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