Methodology for conducting incoming inspection of ICs in metal-ceramic packages

封面

如何引用文章

全文:

开放存取 开放存取
受限制的访问 ##reader.subscriptionAccessGranted##
受限制的访问 订阅或者付费存取

详细

The article examines the resources and competencies required to conduct incoming inspection of ICs in metal-ceramic packages, as well as the difficulties that arise when inspecting foreign-made packages associated with the need to focus on foreign standards.

全文:

受限制的访问

作者简介

A. Alontsev

АО «ТЕСТПРИБОР»

编辑信件的主要联系方式.
Email: kys@electronics.ru

главный конструктор

俄罗斯联邦

补充文件

附件文件
动作
1. JATS XML
2. Fig. 1. Microcircuit in DLGA package

下载 (7KB)
3. Fig. 2. Microcircuits in CLGA/CBGA package

下载 (10KB)
4. Fig. 3. Chips in CQFP package

下载 (6KB)
5. Fig. 4. Microcircuit in CLCC/CQFN package

下载 (7KB)

版权所有 © Alontsev A., 2024