Elektronika: Nauka, Tekhnologiya, Biznes
Periodical scientific and technical journal.
Editor-in-Chief
- Alexander S. Sigov, Academician of the Russian Academy of Sciences, President of the Moscow State Institute of Radio Engineering, Electronics and Automation (Technical University).
Publisher
- Associate printing-and-publication centre «Technosphera»
Founder
- Associate printing-and-publication centre «Technosphera»
Indexing
- Russian Science Citation Index (RSCI)
- CrossRef
- Google Scholar
- Ulrich's Periodicals Directory
- WorldCat
Frequency
- 10 issues per year
About
最新一期
开放存取
##reader.subscriptionAccessGranted##
订阅或者付费存取
编号 7 (2025)
Competent opinion
On the threshold of the “Sodium era”: market potential and localization of Na-ion power sources production in Russia
14-22
Technological audit: when an independent expert assessment is needed
24-28
Success Story
From the supply of instruments to a joint project currently important for the radio-electronics industry
38-44
Artificial Intelligence
Artificial intelligence and the semiconductor industry
摘要
The development of artificial intelligence is impossible without the creation of a specialized element base and CAD tools for its design. At the same time, the introduction of AI systems affects the development of new CAD systems and their functioning.
46-55
Rules and regulations
The concept of trusted electronic component base as a new category of electronic component base products for regulated markets of critical information infrastructure
摘要
The article substantiates the concept of a trusted electronic component base (ECB) for regulated critical information infrastructure (CII) markets as a possible new quality and safety category, in addition to the existing categories of ECB for special-purpose and general-purpose applications. Their features and distinctions are analyzed.
56-74
Electronic components
A set of integrated circuits for electricity meters
摘要
The article describes the main technical characteristics of a new generation of integrated circuits developed by ICC Milandr JSC for electricity meters: the MDR1206FI microcontroller, the MDR5103FI ADC IC, the MDR3401FI RS-485 transceiver IC, and the MDR2306FI flash memory IC.
76-84
Микропроцессоры И ПЛИС
Microcontrollers from Geehy Semiconductor
摘要
Geehy Semiconductor is a fabless company specializing in the development of microcontrollers, systems on chip, analog and mixed-signal integrated circuits. The article reviews the key series of Geehy microcontrollers for civil and industrial applications.
86-90
Radio Systems
SDR technology: when communications get smarter
摘要
The article examines architectural features, element base and practical aspects of implementing software-defined radio (SDR) technology in radio equipment. A line of Cruetech modern software-defined radio modules is presented.
92-96
Information and telecommunication systems
Measuring and control system for efficient agricultural water management
摘要
The article presents intelligent radio sensors for a measuring and control system for rational soil irrigation. The radio sensors feature multi-channel capability, dual power supply from photoelectric converters and a Li-ion battery, support energy saving mode and include protection against electromagnetic interference.
98-103
Microwave electronics
Radio frequency connectors and cables as sources of passive intermodulation in wireless communication systems. Part 1
摘要
The article considers based on a large number of foreign and domestic publications, the physical processes of passive intermodulation in radio frequency connectors and cables used in wireless communication systems. Methods for reducing the level of passive intermodulation are given.
106-112
Micro and nanostructures
Integration of a three-layer stack: the future of smart imaging devices
摘要
This article describes HD TSV and hybrid bonding technologies that enable the integration of various components for sensors and imaging systems. Optimization of the thinning process and reduction of the TSV aspect ratio eliminated electrical leakage and significantly improved TSV performance.
114-118
Reliability and validation
Deep ultraviolet microscopy: principles and prospects of application in industry and science
摘要
The article reviews the physical foundations and practice of application of DUV-microscopy. The development of laser technologies and the emergence of new sensors, modern optical materials opens the way to its widespread implementation in microelectronics, biomedicine and materials science.
120-124
Multi-seat contacting devices
摘要
The article presents modern multi-seat contacting devices as reliable, high-performance and cost-effective solutions for testing electronic and radio products at all stages of production and quality monitoring.
128-129
AOI from China for Russian production facilities
摘要
The article provides an overview of solutions for automatic optical inspection of printed circuit boards during production from ALeader.
130-135
Manufacturing equipment and process materials
Automatic repair of circuit boards after wave soldering is not a dream, but already a reality
摘要
During wave soldering, defects inevitably appear, the number of which directly depends on the speed of the process. The article discusses the features and advantages of ALD-ASR600 automatic wave soldering repair system from ALeader.
136-139
Modern trends in the development of domestic production of electroplating equipment
摘要
The article presents modern electroplating equipment manufactured by «Karachеvsky Zavod «Elektrodetal» JSC. The plant produces automatic and mechanized lines, manual-operated lines, as well as local lines for continuous coating of components on a strip carrier. The manufacturing of the equipment uses highly environmentally friendly materials.
140-142
Production engineering and management
Contract manufacturing: from a weak link to a strong chain. Part 1
摘要
The article examines projects implemented by A-CONTRACT engineers over more than 20 years of the enterprise’s work on the Russian contract manufacturing market, and innovative solutions for non-standard problems that arise in the process of manufacturing high-tech electronic units and modules.
144-148