Мақаланы E-mail арқылы жіберу AOI from China for Russian production facilities
- Авторлар: Shurov D.1
-
Мекемелер:
- ООО «Солидус»
- Шығарылым: № 7 (2025)
- Беттер: 130-135
- Бөлім: Reliability and validation
- URL: https://journals.eco-vector.com/1992-4178/article/view/690224
- DOI: https://doi.org/10.22184/1992-4178.2025.249.7.130.135
- ID: 690224
Дәйексөз келтіру
Ашық рұқсат
Рұқсат берілді
Аннотация
The article provides an overview of solutions for automatic optical inspection of printed circuit boards during production from ALeader.
Толық мәтін
Авторлар туралы
D. Shurov
ООО «Солидус»
Хат алмасуға жауапты Автор.
Email: ds@slds.ru
руководитель направления контрольного оборудования
РесейҚосымша файлдар
Қосымша файлдар
Әрекет
1.
JATS XML
2.
Fig. 1. ALeader office and production facilities
Жүктеу (272KB)
3.
Fig. 2. ALeader 2D and 3D AOI: a – linear 3D AOI ALD8700 series; b – linear 2D AOI ALD7700/5800 series; c – offline 2D AOI ALD7200/7100 series
Жүктеу (105KB)
4.
Fig. 3. ALeader high-tech 3D inspection head
Жүктеу (48KB)
5.
Fig. 4. ALeader moire grating pattern on chip resistors
Жүктеу (244KB)
6.
Fig. 5. Possibility to select IPC-610 standard class in software
Жүктеу (48KB)
7.
Fig. 6. Fillet height is an important parameter for inspection according to IPC-610 standard
Жүктеу (61KB)
8.
Fig. 7. 3D inspection by fillet volume, height, profile and slope using defective (left) and good (right) component as an example
Жүктеу (185KB)
9.
Fig. 8. Profile and slope growth control of the fillet using the example of the “head-on-pillow” defect (left) in comparison with a good component (right)
Жүктеу (191KB)
10.
Fig. 9. A microcircuit in a SOIC package with a defect of broken lead coplanarity
Жүктеу (198KB)
11.
Fig. 10. Violation of the package coplanarity using the example of a capacitor, one side of which is raised by 127 µm relative to the other
Жүктеу (135KB)
12.
Fig. 11. The “tombstone” type defect
Жүктеу (184KB)
13.
Fig. 12. A defect of the dimensions violation, when a capacitor of the same size, but with a thicker case, was installed in place of a resistor
Жүктеу (150KB)
14.
Fig. 13. The “billboarding” defect - mounting a component on its side
Жүктеу (127KB)
15.
Fig. 14. Control of the component displacement relative to the boundaries of the contact pads
Жүктеу (53KB)
16.
Fig. 15. Recognition of OCR marking “on the fly”
Жүктеу (118KB)
17.
Fig. 16. An example of foreign objects found on a printed circuit board (the object dimensions in three dimensions are shown in the corner of the image, indicating that this algorithm works in 3D format)
Жүктеу (198KB)
18.
Fig. 17. Settings for searching for foreign materials not only by area, but also by height
Жүктеу (141KB)
19.
Fig. 18. Inspection of tall aluminum capacitors
Жүктеу (100KB)
20.
Fig. 19. Pin inspection
Жүктеу (118KB)
21.
Fig. 20. ALeader ALD6700 linear 3D SPI system
Жүктеу (42KB)
22.
Fig. 21. An example of building an accurate 3D model of a paste print
Жүктеу (48KB)
23.
Fig. 22. No shading effect due to the use of two 3D projectors (on the right) instead of one (on the left)
Жүктеу (43KB)
24.
Fig. 23. An example of inspection of glue for SMT assembly
Жүктеу (58KB)
25.
Fig. 24. ALeader inspections at each assembly stage (from left to right): SPI, Pre-AOI, Post-AOI
Жүктеу (138KB)
26.
Fig. 25. The verification station operator has data on all stages of the assembly process to analyze the causes of defects
Жүктеу (261KB)
