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- Autores: Shurov D.1
-
Afiliações:
- ООО «Солидус»
- Edição: Nº 7 (2025)
- Páginas: 130-135
- Seção: Reliability and validation
- URL: https://journals.eco-vector.com/1992-4178/article/view/690224
- DOI: https://doi.org/10.22184/1992-4178.2025.249.7.130.135
- ID: 690224
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Resumo
The article provides an overview of solutions for automatic optical inspection of printed circuit boards during production from ALeader.
Texto integral
Sobre autores
D. Shurov
ООО «Солидус»
Autor responsável pela correspondência
Email: ds@slds.ru
руководитель направления контрольного оборудования
RússiaArquivos suplementares
Arquivos suplementares
Ação
1.
JATS XML
2.
Fig. 1. ALeader office and production facilities
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3.
Fig. 2. ALeader 2D and 3D AOI: a – linear 3D AOI ALD8700 series; b – linear 2D AOI ALD7700/5800 series; c – offline 2D AOI ALD7200/7100 series
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4.
Fig. 3. ALeader high-tech 3D inspection head
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Fig. 4. ALeader moire grating pattern on chip resistors
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Fig. 5. Possibility to select IPC-610 standard class in software
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Fig. 6. Fillet height is an important parameter for inspection according to IPC-610 standard
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8.
Fig. 7. 3D inspection by fillet volume, height, profile and slope using defective (left) and good (right) component as an example
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Fig. 8. Profile and slope growth control of the fillet using the example of the “head-on-pillow” defect (left) in comparison with a good component (right)
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Fig. 9. A microcircuit in a SOIC package with a defect of broken lead coplanarity
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11.
Fig. 10. Violation of the package coplanarity using the example of a capacitor, one side of which is raised by 127 µm relative to the other
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Fig. 11. The “tombstone” type defect
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13.
Fig. 12. A defect of the dimensions violation, when a capacitor of the same size, but with a thicker case, was installed in place of a resistor
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Fig. 13. The “billboarding” defect - mounting a component on its side
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Fig. 14. Control of the component displacement relative to the boundaries of the contact pads
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Fig. 15. Recognition of OCR marking “on the fly”
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Fig. 16. An example of foreign objects found on a printed circuit board (the object dimensions in three dimensions are shown in the corner of the image, indicating that this algorithm works in 3D format)
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Fig. 17. Settings for searching for foreign materials not only by area, but also by height
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Fig. 18. Inspection of tall aluminum capacitors
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Fig. 19. Pin inspection
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Fig. 20. ALeader ALD6700 linear 3D SPI system
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Fig. 21. An example of building an accurate 3D model of a paste print
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Fig. 22. No shading effect due to the use of two 3D projectors (on the right) instead of one (on the left)
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Fig. 23. An example of inspection of glue for SMT assembly
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Fig. 24. ALeader inspections at each assembly stage (from left to right): SPI, Pre-AOI, Post-AOI
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Fig. 25. The verification station operator has data on all stages of the assembly process to analyze the causes of defects
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