电邮这篇文章 AOI from China for Russian production facilities
- 作者: Shurov D.1
-
隶属关系:
- ООО «Солидус»
- 期: 编号 7 (2025)
- 页面: 130-135
- 栏目: Reliability and validation
- URL: https://journals.eco-vector.com/1992-4178/article/view/690224
- DOI: https://doi.org/10.22184/1992-4178.2025.249.7.130.135
- ID: 690224
如何引用文章
开放存取
##reader.subscriptionAccessGranted##
详细
The article provides an overview of solutions for automatic optical inspection of printed circuit boards during production from ALeader.
全文:
作者简介
D. Shurov
ООО «Солидус»
编辑信件的主要联系方式.
Email: ds@slds.ru
руководитель направления контрольного оборудования
俄罗斯联邦补充文件
附件文件
动作
1.
JATS XML
2.
Fig. 1. ALeader office and production facilities
下载 (272KB)
3.
Fig. 2. ALeader 2D and 3D AOI: a – linear 3D AOI ALD8700 series; b – linear 2D AOI ALD7700/5800 series; c – offline 2D AOI ALD7200/7100 series
下载 (105KB)
4.
Fig. 3. ALeader high-tech 3D inspection head
下载 (48KB)
5.
Fig. 4. ALeader moire grating pattern on chip resistors
下载 (244KB)
6.
Fig. 5. Possibility to select IPC-610 standard class in software
下载 (48KB)
7.
Fig. 6. Fillet height is an important parameter for inspection according to IPC-610 standard
下载 (61KB)
8.
Fig. 7. 3D inspection by fillet volume, height, profile and slope using defective (left) and good (right) component as an example
下载 (185KB)
9.
Fig. 8. Profile and slope growth control of the fillet using the example of the “head-on-pillow” defect (left) in comparison with a good component (right)
下载 (191KB)
10.
Fig. 9. A microcircuit in a SOIC package with a defect of broken lead coplanarity
下载 (198KB)
11.
Fig. 10. Violation of the package coplanarity using the example of a capacitor, one side of which is raised by 127 µm relative to the other
下载 (135KB)
12.
Fig. 11. The “tombstone” type defect
下载 (184KB)
13.
Fig. 12. A defect of the dimensions violation, when a capacitor of the same size, but with a thicker case, was installed in place of a resistor
下载 (150KB)
14.
Fig. 13. The “billboarding” defect - mounting a component on its side
下载 (127KB)
15.
Fig. 14. Control of the component displacement relative to the boundaries of the contact pads
下载 (53KB)
16.
Fig. 15. Recognition of OCR marking “on the fly”
下载 (118KB)
17.
Fig. 16. An example of foreign objects found on a printed circuit board (the object dimensions in three dimensions are shown in the corner of the image, indicating that this algorithm works in 3D format)
下载 (198KB)
18.
Fig. 17. Settings for searching for foreign materials not only by area, but also by height
下载 (141KB)
19.
Fig. 18. Inspection of tall aluminum capacitors
下载 (100KB)
20.
Fig. 19. Pin inspection
下载 (118KB)
21.
Fig. 20. ALeader ALD6700 linear 3D SPI system
下载 (42KB)
22.
Fig. 21. An example of building an accurate 3D model of a paste print
下载 (48KB)
23.
Fig. 22. No shading effect due to the use of two 3D projectors (on the right) instead of one (on the left)
下载 (43KB)
24.
Fig. 23. An example of inspection of glue for SMT assembly
下载 (58KB)
25.
Fig. 24. ALeader inspections at each assembly stage (from left to right): SPI, Pre-AOI, Post-AOI
下载 (138KB)
26.
Fig. 25. The verification station operator has data on all stages of the assembly process to analyze the causes of defects
下载 (261KB)
