| Edição |
Título |
Arquivo |
| Nº 4 (235) (2024) |
Metal-ceramic packages from “ZPP» JSC for RF and microwave devices |
(Rus)
|
|
Shugaepov S., Ermolaev E., Egoshin V., Gluntsov A.
|
| Nº 9 (230) (2023) |
Materials for microwave equipment shielding. Part 1 |
(Rus)
|
|
Matyskin K., Denisenko A., Korovin E., Trofimov E.
|
| Nº 9 (230) (2023) |
Trends in the production of plastic package ICs |
(Rus)
|
|
Plis N., Rudakov V.
|
| Nº 3 (234) (2024) |
PCB high speed differential pairs for modular connector |
(Rus)
|
|
Shalomanov V., Bakanin D.
|
| Nº 3 (234) (2024) |
Current trends in packaging leadless metal-polymer packages |
(Rus)
|
|
Abashin E., Alekhin S., Gavrilin A., Dantsev O.
|
| Nº 2 (233) (2024) |
Methodology for calculating the thermal conductivity coefficient of composite materials |
(Rus)
|
|
Tsionenko D., Kozlovsky I.
|
| Nº 1 (232) (2024) |
The use of LETSAR electrical insulating heat-resistant tape in the manufacture of cable |
(Rus)
|
|
Fedintseva A.
|
| Nº 1 (222) (2023) |
Dedicated metal-ceramic packages with integrated and local radiation shields |
(Rus)
|
|
Alontsev A., Grabchikov S.
|
| Nº 8 (229) (2023) |
Influence of design parameters on plane strain of printed circuit boards |
(Rus)
|
|
Vantsov S., Khomutskaya O., Liin E.
|
| Nº 6 (227) (2023) |
External factors resistance and reliability of metal-ceramic packages |
(Rus)
|
|
Shugaepov S., Ermolaev E., Egoshin V., Sabirova E.
|
| Nº 5 (226) (2023) |
Structural materials to ensure electromagnetic compatibility of radio equipment |
(Rus)
|
|
Grishin D., Gusev I.
|
| Nº 5 (226) (2023) |
Development of leadless metal-ceramic packages for wide use in ZPP JSC |
(Rus)
|
|
Ermilov R., Shugaepov S., Ermolaev Е., Egoshin V.
|
| Nº 4 (225) (2023) |
New metal-ceramic packages from ZPP JSC |
(Rus)
|
|
Shugaepov S., Ermolaev E., Egoshin V., Loskutova A., Sabirova E.
|
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