English
Русский
简体中文
Português (Brasil)
Kazakh
Eco-vector
Elektronika: Nauka, Tekhnologiya, Biznes
ISSN 1992-4178 (Print) ISSN 1992-4186 (Online)
Menu     Archives
  • Home
  • About the Journal
    • Editorial Team
    • Editorial Policies
    • Author Guidelines
    • About the Journal
  • Issues
    • Search
    • Current
    • Retracted articles
    • Archives
  • Contact
  • Subscriptions
  • All Journals
User
Forgot password? Register
Notifications
  • View
  • Subscribe
Subscription Login to verify subscription
Search
Browse
  • By Issue
  • By Author
  • By Title
  • By Sections
  • Other Journals
  • Categories
Keywords CAD RISC-V architecture artificial intelligence dynamic range electronic components frequency range import substitution information and measurement system insertion loss interface metal-ceramic package microcontroller power printed circuit board printed circuit boards reliability robotics roundness tester switch testing vector network analyzer
×
User
Forgot password? Register
Notifications
  • View
  • Subscribe
Subscription Login to verify subscription
Search
Browse
  • By Issue
  • By Author
  • By Title
  • By Sections
  • Other Journals
  • Categories
Keywords CAD RISC-V architecture artificial intelligence dynamic range electronic components frequency range import substitution information and measurement system insertion loss interface metal-ceramic package microcontroller power printed circuit board printed circuit boards reliability robotics roundness tester switch testing vector network analyzer
Home > Search > Author Details

Author Details

Суханов, Д.

Issue Section Title File
No 9 (2024) Micro and nanostructures Recent achievements in creating chiplets using bridge interconnects
No 10 (2024) Design solutions Trends in packaging and assembly of discrete power components based on MOSFETs
No 2 (2025) Micro and nanostructures Extreme silicon wafers thinning and formation of nano TSV for 3D heterogeneous integration
No 3 (2025) Micromodules and microassemblies Technologies for applying shielding materials to ensure EMC of components in microassemblies
No 5 (2025) Micro and nanostructures Modern technologies of chiplet heterogeneous integration
No 6 (2025) Manufacturing technologies Precision wafer thinning using glass intermediate carrier
No 7 (2025) Micro and nanostructures Integration of a three-layer stack: the future of smart imaging devices
 

 

Developed by ECO-VECTOR

 

Powered by EVESYST

TOP