Автор туралы ақпарат
Суханов, Д.
| Шығарылым | Бөлім | Атауы | Файл |
| № 9 (2024) | Micro and nanostructures | Recent achievements in creating chiplets using bridge interconnects | |
| № 10 (2024) | Design solutions | Trends in packaging and assembly of discrete power components based on MOSFETs | |
| № 2 (2025) | Micro and nanostructures | Extreme silicon wafers thinning and formation of nano TSV for 3D heterogeneous integration | |
| № 3 (2025) | Micromodules and microassemblies | Technologies for applying shielding materials to ensure EMC of components in microassemblies | |
| № 5 (2025) | Micro and nanostructures | Modern technologies of chiplet heterogeneous integration | |
| № 6 (2025) | Manufacturing technologies | Precision wafer thinning using glass intermediate carrier |