Author Details
Суханов, Д.
| Issue | Section | Title | File |
| No 9 (2024) | Micro and nanostructures | Recent achievements in creating chiplets using bridge interconnects | |
| No 10 (2024) | Design solutions | Trends in packaging and assembly of discrete power components based on MOSFETs | |
| No 2 (2025) | Micro and nanostructures | Extreme silicon wafers thinning and formation of nano TSV for 3D heterogeneous integration |