作者的详细信息
Суханов, Д.
| 期 | 栏目 | 标题 | 文件 |
| 编号 9 (2024) | Micro and nanostructures | Recent achievements in creating chiplets using bridge interconnects | |
| 编号 10 (2024) | Design solutions | Trends in packaging and assembly of discrete power components based on MOSFETs | |
| 编号 2 (2025) | Micro and nanostructures | Extreme silicon wafers thinning and formation of nano TSV for 3D heterogeneous integration | |
| 编号 3 (2025) | Micromodules and microassemblies | Technologies for applying shielding materials to ensure EMC of components in microassemblies | |
| 编号 5 (2025) | Micro and nanostructures | Modern technologies of chiplet heterogeneous integration | |
| 编号 6 (2025) | Manufacturing technologies | Precision wafer thinning using glass intermediate carrier | |
| 编号 7 (2025) | Micro and nanostructures | Integration of a three-layer stack: the future of smart imaging devices |