作者的详细信息
Суханов, Д.
| 期 | 栏目 | 标题 | 文件 |
| 编号 9 (2024) | Micro and nanostructures | Recent achievements in creating chiplets using bridge interconnects | |
| 编号 10 (2024) | Design solutions | Trends in packaging and assembly of discrete power components based on MOSFETs | |
| 编号 2 (2025) | Micro and nanostructures | Extreme silicon wafers thinning and formation of nano TSV for 3D heterogeneous integration |