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编号 2 (223) (2023)
Competent opinion
The market needs domestic line of unified drive solutions with high level of delivery readiness
12-18
Exhibitions & conferences
ExpoElectronica 2023 international anniversary exhibition – new sections, new opportunities for exhibitors and visitors
摘要
The article presents the results of the ExpoElectronica 2022 exhibition and discusses the planned significant changes in the organization of the ExpoElectronica 2023 exhibition.
28-30
Economy + busyness
Globalization and monopolization of microelectronics in current conditions
摘要
The article considers the current state of semiconductor production in the world, trends and prospects for the development of microelectronic technologies in various regions. The unprecedented efforts of the United States to return the leading microelectronic industries
to its territory and measures to counteract the development of technologies in China are described.
32-42
CHIPS Act and some aspects of improving the US R&D ecosystem
摘要
As part of the struggle to maintain world dominance, the United States pays great attention to stimulating the development of the semiconductor industry (and, above all, microelectronics) as the basis for the development of the radioelectronic complex branches and the modernization of the economy as a whole at a new technological level. An important aspect of this efforts is the improvement of the microelectronics R&D ecosystem.
44-52
Manufacturing equipment and process materials
Bench-top automatic machine for gold wire mounting by ball-wedge method
摘要
The article describes the bench-top automatic machine for thermosonic micro welding gold wire leads with a diameter of 17.5 to 50 μm featured an automatic system for the alignment of working tool with multi-level pads and a precision three-axis coordinate system based on servo drives. The machine provides automatic leads mounting according to the coordinates of the interconnection points previously stored in the memory.
54-59
Manufacturing technologies
Microbolometers vacuum packaging
摘要
The article describes the development of the microbolometer packaging technology. Packaging is carried out at high vacuum using a getter, which ensures that the specified vacuum level is maintained inside the package of micromechanical device during the period of storage and operation.
60-66
The use of photolithography for the manufacture of metal components at ZPP JSC
摘要
The article considers the use of photolithography at Plant of Semiconductor Devices JSC (ZPP JSC) for the manufacture of various metal components. Examples of products manufactured using this technology are given.
68-70
Stability and reproducibility evaluation of the technological process of metallization through a removable mask
摘要
Based on statistical processing of experimental data, the article presents the stability and reproducibility evaluation of the technological process of two-layer metallization of lithium niobate crystals through a metal removable mask by electron beam evaporation.
72-76
Micro and nanostructures
Characteristics of silicon cantilevers for atomic force microscopy from Angstrem JSC
摘要
The article presents the results of measuring the main parameters of silicon cantilevers manufactured by Angstrem JSC, designed for operation in the semicontact and contact modes of atomic force microscopy (AFM), as well as AFM images of various samples obtained using these cantilevers.
78-86
Electrolytic anodizing of silicon, silicon carbide and silicon nitride for nanotechnology purposes (review)
摘要
The article presents the analysis of technologies for the formation of nanometer anodic oxide films by the method of electrolytic anodization of silicon, silicon carbide and silicon nitride. Examples of the use of such technologies in microand nanoelectronics are given.
88-90
Electronic components
LDMOS: the new products by NIIET JSC
摘要
The article provides information about LDMOS process improvements at NIIET JSC, as well as about new microwave transistors under development by the company which are based on this technology and designed for DVB-T / DVB-T2 TV equipment.
92-96
New from Thinking Electronic: KRV series combined overvoltage and overcurrent protection devices
摘要
The Taiwanese company Thinking Electronic Industrial offers a wide range of components for protecting circuits from excessive voltage, current and temperature. The article discusses the features and advantages of KRV series combined protection devices.
98-100
Overview of SIT products
摘要
The Chinese company Silicon Internet of Things Technology (SIT) specializes in the production of interface chips for automotive and industrial applications. The article provides an overview of the main categories and series of products manufactured by SIT, their key applications.
102-108
Microwave electronics
History of rf connectors. General purpose connectors. Part 2
摘要
The main directions in the development of radio frequency connectors are advancement to higher frequency range, miniaturization, reliability improvement, anchacement of the main parameters. The article considers the following mm-band connectors: 2.4 mm (50 GHz limiting frequency), 1.85 mm (65 GHz), 1.0 mm (110 GHz), 1.35 mm (90 GHz), 0.8 mm (145 GHz).
112-118
Antenna switches. Part 6
摘要
The article considers the antenna switches. Information is provided on the features and characteristics of various types of such devices produced by a number of manufacturers.
120-133
Information and telecommunication systems
Navigation in the city by stationary radio sources
摘要
The article evaluates the possibilities of detecting radio sources with constant coordinates in the city by a radio scanner developed by NIIMA Progress JSC and designed for navigating unmanned vehicles in the absence of information from other sensors.
134-139
Reliability and validation
TESTPRIBOR JSC test center: how to guarantee reliability
摘要
One of the key directions of development of TESTPRIBOR JSC is the expansion of the works carried out at the test center. The article presents the company's capabilities in terms of certification, qualification, acceptance, periodic and other types of tests.
140-141
Test and measurement
Algorithm for introducing compensation coefficients at out-of-round gage
摘要
In the process of preparing the out-of-round gage for operation, it is necessary to calibrate it, which consists in leveling the table and introducing a compensation pressure coefficient.
144-149
Investigation of the operation algorithm of the out-of-round gage centering system
摘要
The analysis of correlations in the compensation system of the out-of-round gage (Spearman correlation analysis) was carried out, correlation graphs were constructed that reflect the dependences of the centering value, compensation coefficients on the mass of weights in the out-of-round gage software module.
150-156