Мақалалар тізімі

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№ 3 (234) (2024) New workshop for «old» harnesses: features of production automation for lettered design documentation
Fedintseva A.
№ 7 (228) (2023) Overview of protective TVS diodes from SHIKUES and SetFuse
Ezhov V.
№ 10 (231) (2023) Domestic smarc computer modules overview
Medvedev A.
№ 2 (223) (2023) Overview of SIT products
Sadekov D.
№ 3 (224) (2023) Equipment and materials for the manufacture of metal parts at ZPP JSC
Polyanin А., Shugaepov S., Ermolaev Е., Egoshin V.
№ 3 (224) (2023) Time-proved equipment: how to properly store materials and components
Chuikova L.
№ 4 (225) (2023) Rationale for the use of a noise-suppressing circuit of a non-contact sensor for measuring geometry defects
Epifantsev K.
№ 10 (231) (2023) Experience practice in organizing interaction between NIIMA «Progress» JSC and universities to attract personnel
Kirik D.
№ 3 (224) (2023) Experience practice with chinese component suppliers: how to avoid risks
Novotorzhentsev D.
№ 3 (224) (2023) Specifics of electron-beam microscale processing of substrates made of various types of ceramics
Zhuo Y., Maslovsky V., Moiseev K., Vorobyov I., Nazarenko М.
№ 10 (231) (2023) Domestic materials and equipment for bare boards – experience exchange and discussion of industry development prospects “RUSCON 2023” science conference of bare boards manufacturers
Kovalevsky Y.
№ 7 (228) (2023) Domestic chip resistors adapted to the requirements of the AEC-Q200 standard and environmental directives
Malyshev I., Eremeev Y., Belkov I.
№ 1 (222) (2023) Asset tracking is an element of the Consul system
Skiba E.
№ 2 (223) (2023) Stability and reproducibility evaluation of the technological process of metallization through a removable mask
Pochtar O., Pochtar A.
№ 3 (234) (2024) Advanced connectors from «Elektrodetal» plant
Gurov R., Gorkov A.
№ 10 (231) (2023) Prospects for diamond technologies in russia: What problems need to be solved first
Astafiev A.
№ 10 (231) (2023) Prospects for diamond technologies in russia: what problems need to be solved first
Skiba E.
№ 1 (232) (2024) Plenary part of the “Microelectronics 2023” Russian forum
Kovalevsky Y.
№ 10 (231) (2023) Plenary part of the “Microelectronics 2023” Russian forum. Part 2
Kovalevsky Y.
№ 2 (233) (2024) Improving the reliability characteristics of multi-lead metal-ceramic packages from ZPP JSC through the use of test systems
Ermilov R., Shugaepov S., Ermolaev E., Egoshin V.
№ 7 (228) (2023) End-to-end cycle of creating sensors and signal processing devices: from requirements specifications to serial production
Polevikov V.
№ 4 (225) (2023) Semiconductors: sales forecasts and development aspects
Makushin M.
№ 1 (222) (2023) Application of algorithmic methods in the process of simulation modeling of technological processes
Lijn E., Khomutskaya O., Vantsov S.
№ 3 (234) (2024) Application of computer vision systems in unmanned aerial vehicles: New opportunities for robotics
Kalinovsky N.
№ 2 (223) (2023) The use of photolithography for the manufacture of metal components at ZPP JSC
Pankratova E., Shugaepov S., Ermolaev E., Egoshin V.
№ 1 (232) (2024) The use of LETSAR electrical insulating heat-resistant tape in the manufacture of cable
Fedintseva A.
№ 7 (228) (2023) Civil products by NIIET JSC: from transistors and microcontrollers to chargers
Maleev V.
№ 3 (224) (2023) Designing finite-state machine in Matlab / Simulink system’s Stateflow tool with subsequent implementation at the FPGA basis
Strogonov А.
№ 7 (228) (2023) There is a rethinking of the priorities of localization and cooperation in the development of electronics technologies
Pereverzev A.
№ 1 (232) (2024) Development of domestic CAD systems for microelectronics design based on the Delta Design platform
Malyshev N.
№ 1 (232) (2024) Development of chemical materials market for microelectronics in Russia: Problems and prospects
Kniga O.
№ 2 (233) (2024) Development of dielectric heat-conducting film adhesive material for the needs of electronics – domestic experience
Egorov A., Danilov E., Ivanov A., Gurova E., Romanov N., Gareev A., Khripunova Y.
№ 3 (234) (2024) Development of AMR converter mathematical model for implementation in CAD
Cheplakov A., Litvinenko E.
№ 3 (224) (2023) Real opportunities for import substitution of power electronics
Vorontsov А., Libenko Y., Chetin А.
№ 2 (223) (2023) The market needs domestic line of unified drive solutions with high level of delivery readiness
Gurbashkov M.
№ 1 (222) (2023) Gallium nitride microwave components: what has changed in two years
Kishchinsky A., Minnebaev V.
№ 3 (234) (2024) Microwave ICs for on-board remote sensing equipment and space communication systems. Part 1
Starovoitov E., Skiba E., Nedashkovsky L.
№ 1 (232) (2024) Microwave switches controlled via USB, SPI and Ethernet interfaces
Kochemasov V.
№ 7 (228) (2023) Today the main task of the state and business is to recreate the electronic engineering industry
Alekseev A.
№ 2 (233) (2024) It’s a perfect time for creating production facilities in Russia
Avetisyan A.
№ 3 (234) (2024) The power of cooperation: equipment born in tandem between manufacturer and customer
Editorial B.
№ 3 (234) (2024) Computer vision systems at industrial enterprises
Shupov A.
№ 7 (228) (2023) Test systems based on programmable power supplies and electronic loads from APM technologies
Fedorov A.
№ 3 (234) (2024) Changing a contractor during 1C:ERP adoption: How to minimize risks
Rogozina Y., Kuznetsova E.
№ 1 (222) (2023) Enhancement of legislation for state defense order. Meeting of the military and industrial policy and budget Section of the Expert council of the Federation Council Committee on defense and security
Kovalevsky Y.
№ 2 (233) (2024) Enhancement of legislation for price setting of products supplied under the state defense order
Kovalevsky Y.
№ 3 (224) (2023) Enhancement of legislation for contract system and procurement procedures
Kovalevsky Y.
№ 7 (228) (2023) Modern domestic base of coaxial radio components for microwave modules and units
Djurinsky K.
№ 1 (232) (2024) State-of-the-art quartz and rubidium oscillators
Ivanov Y.
№ 3 (234) (2024) Current trends in packaging leadless metal-polymer packages
Abashin E., Alekhin S., Gavrilin A., Dantsev O.
№ 4 (225) (2023) Current trends in the improvement of magnetic focusing systems
Jihad Z., Shvachko A.
№ 1 (222) (2023) Dedicated metal-ceramic packages with integrated and local radiation shields
Alontsev A., Grabchikov S.
№ 7 (228) (2023) Electronic identification devices from Angstrem JSC
Shisharin A., Davydov A.
№ 3 (234) (2024) Standard components for wide applications from Youtai Semiconductor
Sadekov D.
№ 2 (233) (2024) Statistical analysis of the influence of time intervals on the result of measuring the force on the probe of RoundTest RA-120P roundness tester
Epifantsev K.
№ 1 (232) (2024) Technological advances give us the opportunity to move forward confidently
Fomenko I.
№ 2 (233) (2024) X-ray inspection technology
Aleinikov P.
№ 7 (228) (2023) Contacting devices and carriers from ZPP JSC for IC testing
Shugaepov S., Ermolaev E., Egoshin V., Magidov E.
№ 1 (232) (2024) UV-curable adhesive elad UF-50 with ultra-low shrinkage for mounting optical elements
Antipova E., Spiridonova A., Korotkova N., Gladkikh S.
№ 1 (232) (2024) Solius FG-018 flux-gel: What do Russian specialists solder with
Potseluev D.
№ 1 (232) (2024) Formulation of Russian passive electronic components road map
Kovalevsky Y.
№ 2 (233) (2024) Generating and studying amplitude-frequency modulation signals using Rigol devices
Lemeshko N., Gorelkin M.
№ 10 (231) (2023) Formation of a data package of coordinate measurements in shape, contour, location control tools
Epifantsev K.
№ 2 (223) (2023) Characteristics of silicon cantilevers for atomic force microscopy from Angstrem JSC
Novak A., Sokolov A., Kovalev V.
№ 7 (228) (2023) In order to keep up with events, you need to get ahead of them
Chikvarkin I.
№ 3 (234) (2024) Wide range of equipment for surface mounting from SmtMaks at ExpoElectronica-2024
Maslov A.
№ 10 (231) (2023) Electric motors in the automotive industry
Averichev D., Berezina Y.
№ 3 (234) (2024) Electric motors for domestic robotics and unmanned vehicles
Dudorov E., Kuvshinov D.
№ 2 (223) (2023) Electrolytic anodizing of silicon, silicon carbide and silicon nitride for nanotechnology purposes (review)
Makharinets A., Mileshko L.
№ 3 (234) (2024) Electronic components from JSC «Zavod Rekond»
Smirnovsky S., Andzhanovskaya Y.
№ 7 (228) (2023) Electro-optical properties of polymer-dispersed liquid crystals doped with nanoparticles
Belyaev V., Avdeenkov V.
№ 10 (231) (2023) An effective personnel strategy is a prerequisite for the leadership of «NIIME» JSC
Polikarpova L., Sadkova N.
№ 1 (232) (2024) An effective approach to designing a control machines for microprocessor cores
Strogonov A., Bordyuzha O., Strogonov A.
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