Browse Title Index

Issue Title File
No 2 (2023) Electrolytic anodizing of silicon, silicon carbide and silicon nitride for nanotechnology purposes (review)
Makharinets A., Mileshko L.
No 6 (2023) Electromagnetic compatibility assurance in the context of changing technologies and market “EMC” the 12th all-Russia science and technology conference
Kovalevsky Y.
No 7 (2023) Electromagnetic compatibility test
Grishin D.
No 2 (2024) Electromagnetic compatibility tests
Gusev I., Faizullaev V.
No 9 (2023) Electromechanical components from ZPP JSC
Rybakov D.
No 8 (2023) Electronic components for rocket and space industry and not only that. “ECB-2023” the 12th All-Russia Science and Technology Conference
Kovalevsky Y.
No 3 (2024) Electronic components from JSC «Zavod Rekond»
Smirnovsky S., Andzhanovskaya Y.
No 7 (2023) Electronic identification devices from Angstrem JSC
Shisharin A., Davydov A.
No 4 (2023) Electronic quality diamond. Innovation. Investments. Creative projects
Luchinin V., Kolyadin A., Yagudaev Y., Ilyin S.
No 7 (2023) Electro-optical properties of polymer-dispersed liquid crystals doped with nanoparticles
Belyaev V., Avdeenkov V.
No 7 (2023) End-to-end cycle of creating sensors and signal processing devices: from requirements specifications to serial production
Polevikov V.
No 5 (2023) End-to-end production cycle of microwave products unique on the Russian market Visit to production facility of SDS Electronics
Kovalevsky Y.
No 5 (2023) Engineering approach to the selection of new manufacturers of microwave components from China
Konakov S.
No 8 (2024) Enhancement of implementation mechanisms of researches focused on creation of advanced armaments and military and special purpose equipment items. Session of the federation council committee on defense and security
Editorial B.
No 3 (2023) Enhancement of legislation for contract system and procurement procedures
Kovalevsky Y.
No 2 (2024) Enhancement of legislation for price setting of products supplied under the state defense order
Kovalevsky Y.
No 1 (2023) Enhancement of legislation for state defense order. Meeting of the military and industrial policy and budget Section of the Expert council of the Federation Council Committee on defense and security
Kovalevsky Y.
No 3 (2023) Equipment and materials for the manufacture of metal parts at ZPP JSC
Polyanin А., Shugaepov S., Ermolaev Е., Egoshin V.
No 9 (2024) Equipment power data as an additional source of information for the information and measurement system
Antsev A., Barsukov D., Vorotilin M., Tsivenkova A., Yanov E.
No 8 (2024) EUV lithography: what is expected in 2025?
Makushin M.
No 2 (2025) Evaluation of 3D Flash Ladar technology capabilities for use in on-board sensors for highly automated vehicles
Starovoytov E., Kondrashov Z., Ignatenko V.
No 7 (2024) Evaluation of the measurement error of group delay time using a reflectometer
Filippov D., Bakulin A., Zavgorodniy A., Afanasyev M.
No 7 (2024) Every atom counts: the use of high-purity gases in the microelectronics industry
Dubyaga S., Kozyrev I.
No 7 (2024) Evolution of SMP connectors. 100 Ghz frequency is no longer the limit
Dzhurinsky K., Androsov A.
No 9 (2024) Example of implementation of a single-CYCLE RISC-V processor core using Altera Quartus II Cad
Strogonov A.V., Vinokurov A., Strogonov A.I.
No 6 (2023) Expanded line of PR1-25 high-power coaxial RF and microwave resistive absorbers
Malyshev I., Eremeev Y., Belkov I.
No 10 (2023) Experience practice in organizing interaction between NIIMA «Progress» JSC and universities to attract personnel
Kirik D.
No 3 (2023) Experience practice with chinese component suppliers: how to avoid risks
Novotorzhentsev D.
No 5 (2023) Expert Electronics research and production company
Editorial B.
No 2 (2025) ExpoElectronica – 365 days a year. Innovative approach to forming the industry community
Editorial T.
No 2 (2023) ExpoElectronica 2023 international anniversary exhibition – new sections, new opportunities for exhibitors and visitors
Mangusheva R.
No 2 (2024) ExpoElectronica 2024 international exhibition – new sections, new companies, new opportunities for participants and visitors
Mangusheva R.
No 6 (2023) External factors resistance and reliability of metal-ceramic packages
Shugaepov S., Ermolaev E., Egoshin V., Sabirova E.
No 2 (2025) Extreme silicon wafers thinning and formation of nano TSV for 3D heterogeneous integration
Sukhanov D.
No 8 (2023) Features of measuring the MIS-HEMT DIE-package thermal resistance
Strogonov A., Kharchenko M., Khanin A.
No 10 (2024) Features of the application of multichannel signal generators using the example of Nosean MSG5000 series devices Part 2
Lemeshko N., Gorelkin M.
No 9 (2024) Features of the application of multichannel signal generators using the example of Nosean MSG5000 series devices. Part 1
Lemeshko N., Gorelkin M.
No 8 (2024) Features of the conformity assessment of electronic components, radioelectronic equipment and materials using computational methods
Kozyukov A., Kozhuhov M., Protopopov G., Kazantsev D.
No 5 (2024) Features of the designing and manufacturing technology of mm-wavelength connectors
Dzhurinsky K.
No 3 (2024) Fiber-optic gyroscopes and systems based on them. Part 1
Berezina Y.
No 4 (2024) Fiber-optic gyroscopes and systems based on them. Part 2
Berezina Y.
No 3 (2024) FLEX after a lapse of a year and a half: Practice confirms the demand for solutions for the rapid building of balanced production facilities
Lipkin E., Gogin O.
No 5 (2024) Foreign and domestic multilayer ceramic capacitors: technologies, quality categories
Savitsky V., Raskin A.
No 10 (2023) Formation of a data package of coordinate measurements in shape, contour, location control tools
Epifantsev K.
No 1 (2024) Formulation of Russian passive electronic components road map
Kovalevsky Y.
No 7 (2024) Four factors to reduce production costs by two orders of magnitude. Visit to the production facility of BUTIS LTD.
Kovalevsky Y.
No 6 (2024) From production audit to strategic partnership
Veretsky A.
No 1 (2023) Gallium nitride microwave components: what has changed in two years
Kishchinsky A., Minnebaev V.
No 9 (2024) GaN power and microwave transistors by NIIET JSC: existing solutions and prospects
Semeykin I.
No 2 (2024) Generating and studying amplitude-frequency modulation signals using Rigol devices
Lemeshko N., Gorelkin M.
No 2 (2023) Globalization and monopolization of microelectronics in current conditions
Shelepin N.
No 7 (2024) Growth rates of the “Microelectronics” forum reflect the development of electronics industry of our country
Kondrashov Z.K.
No 6 (2024) Harness production facility: CNC machine for laying out wires and other advanced developments
Fedintseva A.
No 7 (2023) High quality capacitors from Jinpei Electronics
Sokolov M.
No 6 (2024) Highly reliable modular secondary power supplies
Glukhov D.
No 1 (2023) History of rf connectors. general purpose connectors. Part 1
Djurinsky K.
No 2 (2023) History of rf connectors. General purpose connectors. Part 2
Djurinsky K.
No 3 (2023) History of RF connectors. Instrument and metrology connectors
Djurinsky К.
No 4 (2023) How do we develop domestic microelectronics: 2023
Enns V.
No 6 (2024) How is your pH? Key requirements and approaches to the selection of liquids for cleaning printed circuit assemblies on a ph-neutral basis
Potseluev D.
No 4 (2024) How test and measurement instruments for microwave electronics are created: quality, accuracy, and… cost-effectiveness. Visit to the production facility of PLANAR LLC
Kovalevsky Y.
No 8 (2023) How to automate control of manual operations?
Aleinikov P.
No 8 (2024) How to choose a climate chamber
Valiev R.
No 4 (2023) How to correctly choose and optimally apply vector network analysers. “Fundamentals of measurement” workshop
Kovalevsky Y.
No 8 (2023) How to counter coming cryptographic systems hacking threats
Shakhovoy R., Losev A.
No 3 (2024) How to create a clean production room. Technologies and equipment
Usatov A., Lyakhov P.
No 3 (2023) How to defeat the dragon: implementation of 1C:ERP in the contract manufacturing of electronics using the Agile methodology
Rogozina Y., Kuznetsova E.
No 1 (2024) Human capital in the field of microwave measurement: demands and ways to meet them
Kovalevsky Y.
No 10 (2023) Human capital in the field of microwave measurement: demands and ways to meet them. Part 1
Kovalevsky Y.S.
No 7 (2024) IC Socket is your partner in the development of measuring and testing equipment
Kapshunova Y., Kolochkov S.
No 6 (2024) Identification of analog measuring instruments readings using neural networks
Chuprinova O.
No 7 (2023) Import substitution in the field of production equipment: solutions from PROTECH
Koval Y.
No 6 (2023) Improving quality of noise suppression in power supply circuits by means of B36 filters
Makhin D., Sizikov A.
No 2 (2024) Improving the reliability characteristics of multi-lead metal-ceramic packages from ZPP JSC through the use of test systems
Ermilov R., Shugaepov S., Ermolaev E., Egoshin V.
No 7 (2023) In order to keep up with events, you need to get ahead of them
Chikvarkin I.
No 2 (2024) In the current conditions, one needs to permanently be at the ready
Kutsko P.
No 3 (2024) In today’s world, navigation and communication will be inviolable factors in technological advantage and independence of the country
Kondrashov Z.
No 8 (2023) Incoming inspection of materials is the basis for the quality of metal-ceramic packages from ZPP JSC
Shugaepov S., Ermolaev E., Egoshin V., Khanina Y.
No 8 (2023) Influence of design parameters on plane strain of printed circuit boards
Vantsov S., Khomutskaya O., Liin E.
No 5 (2024) Influence of the structure and properties of thin Osmium films on the emissivity and durability of the cathode
Solyanik V., Miroshnichenko A.
No 9 (2024) Innovation from JSC ZPP: metal-ceramic package with j-terminals
Shugaepov S., Ermolaev E., Egoshin V., Gluntsov A., Loskutova A.
No 4 (2023) Intelligent navigation of unmanned agricultural machinery
Starovoitov E., Skiba E.
No 7 (2024) International experience in developing RISC-V processor cores and open source software tools for their design
Strogonov A.V., Bordyuzha O., Strogonov A.I.
No 5 (2023) Investigation of activation-sensitization systems for PCB small-scale and single-piece production
Barakovsky F., Vantsov S.
No 5 (2024) Investigation of laser scanning systems for measuring shape defects
Epifantsev K.
No 6 (2023) Investigation of the influence of probe inclination angle and location of touch points on the measurement accuracy of roundtest RA‑120P Round Tester
Epifantsev K., Efremov N.
No 2 (2023) Investigation of the operation algorithm of the out-of-round gage centering system
Epifantsev K.
No 8 (2023) Isolated current transducers
Masalov V.
No 1 (2023) It is exciting for us to dream and achieve dreams, discover new markets
Yurov V.V.
No 10 (2023) It is not easy to find top experts. But it is possible to raise them
Ryabokul A.S.
No 2 (2024) It’s a perfect time for creating production facilities in Russia
Avetisyan A.
No 5 (2023) K10-90 ceramic chip capacitors ranging from 1005M (0402) in size produced in series by Kulon LLC
Makhin D., Sizikov А.
No 3 (2024) KHARZA® modular drive is a new approach to solving problems
Gurbashkov M.
No 3 (2024) KingTech is a new expert in the field of TFT LCD display production
Pavlenko A.
No 1 (2023) Large-scale opportunities: the specifics of the Russian assembly service for consumer electronics - realities and market potential
Lishik S.A.
No 10 (2024) Laser location systems 3D Flash Ladar for intelligent transport navigation
Starovoytov E., Skiba E.
No 2 (2023) LDMOS: the new products by NIIET JSC
Alekseev R., Semeykin I., Tsotsorin A., Kurshev P.
No 7 (2023) Line of telematics modules: achievements and development prospects
Chikvarkin I.
No 10 (2024) Localization of equipment production: from fume extractors to unique robotic setups Visit to the production facility of Protech LTD.
Kovalevsky Y.
No 7 (2024) Magnetic ICs based on thin film magnetoresistors and the possibility of their use in control and automation systems
Yurov A., Polevikov V., Fedina A.
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