Browse Title Index

Issue Title File
No 9 (2024) Selective soldering is the optimal solution for mounting multilayer heat-intensive pcb
Vityugov A.
No 2 (2025) Semiconductor manufacturing equipment: steady growth in purchases until 2027
Makushin M.
No 4 (2023) Semiconductors: sales forecasts and development aspects
Makushin M.
No 7 (2024) Serial electronics assembly production from scratch
Konurin K.Y.
No 2 (2024) SETsafe | SETfuse: 24 years of development and production of electrical circuit protection components
Trubachev B.
No 9 (2023) Shinhom magnetic components
Sokolov M.
No 3 (2024) Simulating a solar cell with a regular surface texture using technology level CAD
Plotnikova E., Arsentiev A., Vinokurov A.
No 7 (2023) Simulation of electronic devices with regard to the stochastic characteristics of their components
Legan Y.
No 2 (2025) Simulation of Si–sio2 interface depassivation in LDMOS transistor structure using Sentaurus TCAD
Alekseev R., Maltsev V.
No 3 (2023) Si-OLED microdisplays from Top Display Optoelectronics
Pavlenko А.
No 3 (2023) SK4-MAX6 signal and spectrum analyzer – made in Russia
Timonovich А.
No 1 (2024) Smart concept: how to build world-class production facilities in Russia
Zavalko A.V.
No 2 (2025) Social and psychological aspects of the implementation of technological equipment monitoring systems and their impact on improving the efficiency of machine-building enterprises
Vorotilin M., Karavdin L., Minakov E., Yanov E.
No 2 (2025) Soldering paste. Let’s prepare it correctly!
Kovensky V., Poryadin R.
No 1 (2024) Solius FG-018 flux-gel: What do Russian specialists solder with
Potseluev D.
No 6 (2025) Special types of analysis for modern ICS: challenges of nanometer technologies and application of AI methods
Stempkovsky А., Kozhevnikov E., Demidov Е., Soloviev R., Telpukhov D., Pereverzev L., Kartashev V., Dozhdev V., Nazarov I., Tretyakov A.
No 3 (2023) Specifics of electron-beam microscale processing of substrates made of various types of ceramics
Zhuo Y., Maslovsky V., Moiseev K., Vorobyov I., Nazarenko М.
No 7 (2024) Spray photoresist application to create a uniform film in cavities
Ivanov V.
No 2 (2023) Stability and reproducibility evaluation of the technological process of metallization through a removable mask
Pochtar O., Pochtar A.
No 3 (2024) Standard components for wide applications from Youtai Semiconductor
Sadekov D.
No 1 (2024) State-of-the-art quartz and rubidium oscillators
Ivanov Y.
No 2 (2024) Statistical analysis of the influence of time intervals on the result of measuring the force on the probe of RoundTest RA-120P roundness tester
Epifantsev K.
No 5 (2023) Structural materials to ensure electromagnetic compatibility of radio equipment
Grishin D., Gusev I.
No 7 (2023) Study of memristor structures based on copper and tin oxides
Permyakov D., Strogonov A.
No 4 (2025) Study of the Influence of the Error in Setting the Angle of Inclination of The Contour Measuring Machine Drive on the Result of Final Measurements: A Vector for Improving the Verification Methodology
Epifantsev K.
No 3 (2025) Successful completion of 1С:ERP adoption. Strategic results and economic efficiency for contract manufacturing
Rodnov S., Kuznetsova E.
No 2 (2025) SUNEAST is a leader in PCB soldering equipment
Rubai D.
No 9 (2023) Supercapacitors. Service life and energy density increasing
Bogush I., Plugotarenko N., Myasoedova T.
No 3 (2025) Support for young scientists as a mechanism for developing new personnel in key areas: the experience of the Foundation for assistance to innovations
Polyakov S.
No 6 (2024) Support-rotating devices in various industries
Averichev D., Berezina Y.
No 7 (2024) Synchronization of base stations in CONSUL-R integrated navigation and communication system
Starovoytov E., Skiba E., Sinilshchikov I., Alpatov A.
No 1 (2024) Technological advances give us the opportunity to move forward confidently
Fomenko I.N.
No 7 (2025) Technological audit: when an independent expert assessment is needed
Editorial T.
No 7 (2024) Technologies and equipment for temporary and permanent bonding of semiconductor wafers
Mandrik I., Novozhilov I.
No 3 (2025) Technologies for applying shielding materials to ensure EMC of components in microassemblies
Sukhanov D.
No 3 (2025) Technologies for successful business: engineering, integration, implementation
Editorial T.
No 6 (2025) Technologies that open up new opportunities not just in theory but in practice. Visit to additive technology center of dipaul group
Kovalevsky Y.
No 3 (2025) Technopark ERCON takes a course to import substitution
Malyshev I.
No 7 (2023) Test systems based on programmable power supplies and electronic loads from APM technologies
Fedorov A.
No 5 (2023) Test telemetry generator: accelerating the development of software for control systems products in the absence of a product and its test equipment
Belov S.
No 2 (2023) TESTPRIBOR JSC test center: how to guarantee reliability
Shekhovtsova E.
No 6 (2025) Tethered drones and the role of smartpower high-voltage DC/DC converters in ensuring stable power supply
Gaikazyan T.
No 7 (2025) The concept of trusted electronic component base as a new category of electronic component base products for regulated markets of critical information infrastructure
Nikiforov A., Telets V., Kessarinsky L., Levin R., Boychenko D.
No 3 (2025) The influence of direct solar illumination on 3D Flash Ladar sensors for highly automated vehicles
Starovoytov E., Kondrashov Z., Ignatenko V.
No 3 (2025) The influence of environmental factors on the radon hazard of the territory of St. Petersburg
Kalashnikova M.
No 3 (2024) The key challenge for the robotics industry is to build close cooperation
Gurbashkov M.
No 3 (2025) The main factor of our success is the combination of scientific knowledge and engineering expertise
Editorial T.
No 2 (2023) The market needs domestic line of unified drive solutions with high level of delivery readiness
Gurbashkov M.
No 9 (2024) The Microelectronics 2024 Forum is a unique platform that brings together key representatives of Science, Business, Industry and Government Bodies
Editorial B.
No 3 (2024) The next level of production means not only its expansion, but also a significant increase in product quality
Ulyanov S.A.
No 3 (2024) The power of cooperation: equipment born in tandem between manufacturer and customer
Editorial B.
No 5 (2024) The priority is to expand the range of solutions, develop production and, of course, train personnel
Editorial B.
No 1 (2023) The priority is to implement new competitive technologies
Buynevich A.S.
No 10 (2024) The professional standard in the field of photonics as a tool for providing the industry with highly qualified personnel
Krupkina T., Kulpinov M., Losev V., Putrya M., Chaplygin Y., Balashov A.
No 5 (2025) The second conference of young scientists “Onboard control systems”: results of a vivid scientific dialogue
Kuznetsov P., Sinelnikov A.
No 8 (2024) The shortage of special quartz glass fixture for planar technology in the production of microelectronics will be overcome
Elisov P.
No 10 (2024) The state and development of localization in domestic automotive electronics
Chistov A., Danilkina Y.
No 1 (2025) The success and prestige of the russian electronics industry depends on all of us
Editorial T.
No 1 (2024) The use of LETSAR electrical insulating heat-resistant tape in the manufacture of cable
Fedintseva A.
No 8 (2024) The use of optical sensors for mutual positioning of antennas during testing of radio systems
Starovoytov E., Skiba E., Russanov V.
No 2 (2023) The use of photolithography for the manufacture of metal components at ZPP JSC
Pankratova E., Shugaepov S., Ermolaev E., Egoshin V.
No 8 (2024) The use of precision methods for electrical testing of metal-ceramic packages
Shugaepov S., Egoshin V., Ermolaev E., Taikov D.
No 7 (2023) There is a rethinking of the priorities of localization and cooperation in the development of electronics technologies
Pereverzev A.L.
No 6 (2025) There is expertise to create domestic microelectronics cad in our country
Editorial B.
No 3 (2023) There is very good prospect for components producers, and we must use this opportunity
Sizikov A.V.
No 5 (2025) Thin metal oxide films for flexible and stretchable electronic devices
Belykh M., Permyakov D., Strogonov A.
No 5 (2023) Three-gap multifrequency resonator for miniature Multibeam klystrons
Miroshnichenko А., Chernyshev М., Akafyeva N.
No 3 (2023) Time-proved equipment: how to properly store materials and components
Chuikova L.
No 7 (2024) To aspire to the future while learning from the past
Ippolitov K.M.
No 7 (2023) Today the main task of the state and business is to recreate the electronic engineering industry
Alekseev A.
No 3 (2025) Training personnel for the electronics industry. A view from the Аoundation for advanced research
Zablotsky A.
No 6 (2023) Trassa‑1P 32‑bit universal microcontroller being developed by Angstrem JSC: characteristics and development prospects
Shisharin A.
No 7 (2024) Trends and problems of development of domestic electronic engineering
Alekseev A.N.
No 10 (2024) Trends in packaging and assembly of discrete power components based on MOSFETs
Ivanov V., Sukhanov D.
No 9 (2023) Trends in the production of plastic package ICs
Plis N., Rudakov V.
No 8 (2024) Trust begins with electronic components
Editorial B.
No 8 (2024) Tula State University trains new generation of engineers
Yanov E., Markarova O.
No 4 (2024) Ultra-short pulse probing signals in near location systems
Ivantsov A., Fabrichny M., Fedorov A.
No 3 (2025) Unique russian solutions for automation of the harness production facility under the letter CD
Koval Y.
No 8 (2023) Universal automatic battery testing system
Chebanov A., Shostak A.
No 8 (2024) Up-to-date methods of quality control during electronic component mounting
Kremlev K.
No 7 (2024) USB Type-C Connectors
Andriyanova M.
No 10 (2023) Use of artificial intelligence and computer simulation in the field of superconductivity
Abdyukhanov I., Terina M., Savelyev I., Tsapleva A., Alekseev M.
No 10 (2024) Use of domestic deep-calcined alumina for the production of metal-ceramic packages
Egoshin V., Shugaepov S., Akhmetgaliev R., Ermolaev E., Mazurenko A., Chernysheva Y.
No 4 (2024) Use of electronic components with expired storage period
Dudunov A.
No 4 (2024) Use of robotics and artificial intelligence in enterprises of military-industrial complex. Meeting of the Military and Industrial Policy and Budget Section of The Expert Council of The Federation Council Committee on Defense And Security
Kovalevsky Y.
No 5 (2024) Use of Russian Electronic components and measures aimed at stuffing the industry
Kovalevsky Y.
No 5 (2024) Use of russian passive electronic components in automotive industry
Editorial B.
No 4 (2024) Using artificial neural networks to control computational processes
Nazarov S., Dubrovsky A.
No 1 (2024) UV-curable adhesive elad UF-50 with ultra-low shrinkage for mounting optical elements
Antipova E., Spiridonova A., Korotkova N., Gladkikh S.
No 1 (2025) Vectors for the development of domestic electronics in a global context
Shpak V.
No 3 (2025) VTR 8.1.0 CAD tools for exploring new FPGA architectures
Strogonov A.V., Gopenko K., Strogonov A.I.
No 10 (2023) Waveguide microwave switches
Kochemasov V.
No 7 (2023) We are ready to offer non-standard solutions
Kapshunova Y.
No 8 (2024) We are restoring the system of education of unique specialists urgently demanded by the electronics industry
Editorial B.
No 3 (2023) We come to the customers not with a component, but with a solution to their problem
Semyonov D.А.
No 9 (2023) We should learn to support each other
Kutsko P.
No 3 (2024) We successfully got through a hard period thanks to diversification of supplies
Dedyukhin A.
No 7 (2024) We want the customer to see us as a strategic partner
Krupenin I.K.
No 3 (2023) We want to become a company the russian customers trust the most
Helmi F.
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