| Шығарылым |
Атауы |
Файл |
| № 8 (2024) |
Enhancement of implementation mechanisms of researches focused on creation of advanced armaments and military and special purpose equipment items. Session of the federation council committee on defense and security |
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Editorial B.
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| № 7 (2023) |
Modern domestic base of coaxial radio components for microwave modules and units |
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Djurinsky K.
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| № 1 (2024) |
State-of-the-art quartz and rubidium oscillators |
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Ivanov Y.
|
| № 1 (2025) |
Modern methods of removing contaminants from substrates in microelectronics |
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Lelyaev V.
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| № 3 (2024) |
Current trends in packaging leadless metal-polymer packages |
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Abashin E., Alekhin S., Gavrilin A., Dantsev O.
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| № 4 (2023) |
Current trends in the improvement of magnetic focusing systems |
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Jihad Z., Shvachko A.
|
| № 5 (2025) |
Modern technologies of chiplet heterogeneous integration |
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Sukhanov D.
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| № 6 (2023) |
Modern business requires a flexible approach and responsiveness |
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Krupenin I.
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| № 5 (2023) |
Connectors for unmanned systems |
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Perminov P.
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| № 9 (2024) |
Connectors from TESTPRIBOR JSC |
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Ermatova A.
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| № 7 (2024) |
Connectors with a contact pair of increased reliability from the Elektrodetal plant |
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Gurov R.
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| № 6 (2024) |
Creating world-class production facilities in Russia: priorities, problems, prospects |
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Lipkin E.
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| № 5 (2024) |
Design of radio-photonic equipment based on optical and microwave electronics technologies |
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Belkin M., Vasiliev M., Klyushnik D., Kuznetsov E.
|
| № 10 (2024) |
The state and development of localization in domestic automotive electronics |
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Chistov A., Danilkina Y.
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| № 2 (2025) |
Social and psychological aspects of the implementation of technological equipment monitoring systems and their impact on improving the efficiency of machine-building enterprises |
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Vorotilin M., Karavdin L., Minakov E., Yanov E.
|
| № 1 (2023) |
Dedicated metal-ceramic packages with integrated and local radiation shields |
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Alontsev A., Grabchikov S.
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| № 7 (2024) |
Spray photoresist application to create a uniform film in cavities |
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Ivanov V.
|
| № 9 (2024) |
Comparative analysis of the dependence of contourograph measurement accuracy on the angular and speed parameters of the probe |
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Epifantsev K.
|
| № 3 (2025) |
Comparative analysis of the characteristics of the high-speed connector Multigig RT2 (USA) and the domestic analogue produced by Radiant-EK JSC |
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Shalomanov V., Bakanin D., Shadrunov E.
|
| № 7 (2023) |
Electronic identification devices from Angstrem JSC |
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Shisharin A., Davydov A.
|
| № 3 (2024) |
Standard components for wide applications from Youtai Semiconductor |
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Sadekov D.
|
| № 2 (2024) |
Statistical analysis of the influence of time intervals on the result of measuring the force on the probe of RoundTest RA-120P roundness tester |
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Epifantsev K.
|
| № 6 (2023) |
External factors resistance and reliability of metal-ceramic packages |
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Shugaepov S., Ermolaev E., Egoshin V., Sabirova E.
|
| № 7 (2024) |
To aspire to the future while learning from the past |
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Ippolitov K.
|
| № 9 (2023) |
Supercapacitors. Service life and energy density increasing |
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Bogush I., Plugotarenko N., Myasoedova T.
|
| № 9 (2023) |
Trends in the production of plastic package ICs |
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Plis N., Rudakov V.
|
| № 10 (2024) |
Trends in packaging and assembly of discrete power components based on MOSFETs |
|
|
Ivanov V., Sukhanov D.
|
| № 7 (2024) |
Technologies and equipment for temporary and permanent bonding of semiconductor wafers |
|
|
Mandrik I., Novozhilov I.
|
| № 3 (2025) |
Technologies for applying shielding materials to ensure EMC of components in microassemblies |
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Sukhanov D.
|
| № 3 (2025) |
Technologies for successful business: engineering, integration, implementation |
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Editorial T.
|
| № 1 (2024) |
Technological advances give us the opportunity to move forward confidently |
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Fomenko I.
|
| № 2 (2025) |
Planetary mixing technology for the preparation of sealants and other materials |
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Koval Y.
|
| № 2 (2024) |
X-ray inspection technology |
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Aleinikov P.
|
| № 3 (2025) |
Technopark ERCON takes a course to import substitution |
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Malyshev I.
|
| № 5 (2025) |
Thin metal oxide films for flexible and stretchable electronic devices |
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Belykh M., Permyakov D., Strogonov A.
|
| № 7 (2024) |
Trends and problems of development of domestic electronic engineering |
|
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Alekseev A.
|
| № 5 (2023) |
Three-gap multifrequency resonator for miniature Multibeam klystrons |
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Miroshnichenko А., Chernyshev М., Akafyeva N.
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| № 6 (2023) |
Difficulties in implementing the chips act in the US |
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Avdonin B., Makushin M.
|
| № 6 (2023) |
Deepening self-diagnosis of test and verification equipment of control systems: migration from Windows to Linux |
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Belov S.
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| № 9 (2023) |
You can strengthen your position in the civilian market by maximizing the range of products produced |
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Romanov V.
|
| № 8 (2023) |
Universal automatic battery testing system |
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Chebanov A., Shostak A.
|
| № 3 (2025) |
Unique russian solutions for automation of the harness production facility under the letter CD |
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Koval Y.
|
| № 1 (2025) |
The success and prestige of the russian electronics industry depends on all of us |
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Editorial T.
|
| № 3 (2025) |
Successful completion of 1С:ERP adoption. Strategic results and economic efficiency for contract manufacturing |
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Rodnov S., Kuznetsova E.
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| № 7 (2023) |
Contacting devices and carriers from ZPP JSC for IC testing |
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Shugaepov S., Ermolaev E., Egoshin V., Magidov E.
|
| № 1 (2024) |
UV-curable adhesive elad UF-50 with ultra-low shrinkage for mounting optical elements |
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Antipova E., Spiridonova A., Korotkova N., Gladkikh S.
|
| № 3 (2025) |
Learning is light and profit, and not learning is darkness and loss |
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Rubai D.
|
| № 1 (2024) |
Solius FG-018 flux-gel: What do Russian specialists solder with |
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Potseluev D.
|
| № 1 (2024) |
Formulation of Russian passive electronic components road map |
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Kovalevsky Y.
|
| № 2 (2024) |
Generating and studying amplitude-frequency modulation signals using Rigol devices |
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Lemeshko N., Gorelkin M.
|
| № 3 (2025) |
Formation of a new generation of engineers at the Tula engineering school – a solution to personnel problems for enterprises of the military-industrial complex |
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Vorotilin M., Feofilov S., Fomicheva O., Yanov E.
|
| № 10 (2023) |
Formation of a data package of coordinate measurements in shape, contour, location control tools |
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Epifantsev K.
|
| № 9 (2024) |
The Microelectronics 2024 Forum is a unique platform that brings together key representatives of Science, Business, Industry and Government Bodies |
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Editorial B.
|
| № 6 (2023) |
Photopiezoelectric receiver of optical signals based on surface acoustic waves |
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Mitrokhin V., Strogonov A., Gurov A., Lyalin D.
|
| № 2 (2023) |
Characteristics of silicon cantilevers for atomic force microscopy from Angstrem JSC |
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Novak A., Sokolov A., Kovalev V.
|
| № 1 (2025) |
Four ways to decapsulate semiconductor devices |
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Varlamov P.
|
| № 7 (2024) |
Four factors to reduce production costs by two orders of magnitude. Visit to the production facility of BUTIS LTD. |
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Kovalevsky Y.
|
| № 8 (2023) |
Chiplets and heterogeneous integration as a basic technology stack capable of ensuring the sovereignty of domestic electronics in a new technological order |
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Achkasov A.
|
| № 7 (2023) |
In order to keep up with events, you need to get ahead of them |
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Chikvarkin I.
|
| № 6 (2023) |
Miracles don’t happen. But many still hope on them |
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Vasilenko A.
|
| № 3 (2024) |
Wide range of equipment for surface mounting from SmtMaks at ExpoElectronica-2024 |
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Maslov A.
|
| № 7 (2024) |
Evolution of SMP connectors. 100 Ghz frequency is no longer the limit |
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Dzhurinsky K., Androsov A.
|
| № 8 (2023) |
Electronic components for rocket and space industry and not only that. “ECB-2023” the 12th All-Russia Science and Technology Conference |
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Kovalevsky Y.
|
| № 4 (2025) |
Power Supply System Electronic Components for GaN Microwave Power Amplifiers |
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Savchenko E., Martynov A., Pershin A., Selivanov M.
|
| № 10 (2024) |
Ecological significance and main objectives of the study of potential radon hazard of the territory |
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Kalashnikova M.
|
| № 5 (2025) |
Expertise for solving unconventional and complex tasks – that’s us |
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Editorial B.
|
| № 2 (2025) |
Extreme silicon wafers thinning and formation of nano TSV for 3D heterogeneous integration |
|
|
Sukhanov D.
|
| № 10 (2023) |
Electric motors in the automotive industry |
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Averichev D., Berezina Y.
|
| № 3 (2024) |
Electric motors for domestic robotics and unmanned vehicles |
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Dudorov E., Kuvshinov D.
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| № 2 (2023) |
Electrolytic anodizing of silicon, silicon carbide and silicon nitride for nanotechnology purposes (review) |
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Makharinets A., Mileshko L.
|
| № 9 (2023) |
Electromechanical components from ZPP JSC |
|
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Rybakov D.
|
| № 3 (2024) |
Electronic components from JSC «Zavod Rekond» |
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Smirnovsky S., Andzhanovskaya Y.
|
| № 7 (2023) |
Electro-optical properties of polymer-dispersed liquid crystals doped with nanoparticles |
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Belyaev V., Avdeenkov V.
|
| № 10 (2023) |
An effective personnel strategy is a prerequisite for the leadership of «NIIME» JSC |
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Polikarpova L., Sadkova N.
|
| № 1 (2024) |
An effective approach to designing a control machines for microprocessor cores |
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Strogonov A., Bordyuzha O., Strogonov A.
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| Нәтижелер 475 - 401/475 |
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