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编号 3 (2025) Features and trends of the labor market in the electrical engineering industry in the Russian Federation
Artemyeva E.
编号 8 (2023) Features of measuring the MIS-HEMT DIE-package thermal resistance
Strogonov A., Kharchenko M., Khanin A.
编号 5 (2024) Features of the designing and manufacturing technology of mm-wavelength connectors
Dzhurinsky K.
编号 10 (2024) Features of the application of multichannel signal generators using the example of Nosean MSG5000 series devices Part 2
Lemeshko N., Gorelkin M.
编号 9 (2024) Features of the application of multichannel signal generators using the example of Nosean MSG5000 series devices. Part 1
Lemeshko N., Gorelkin M.
编号 8 (2024) Features of the conformity assessment of electronic components, radioelectronic equipment and materials using computational methods
Kozyukov A., Kozhuhov M., Protopopov G., Kazantsev D.
编号 1 (2025) Features of burn-in testing of semiconductor electronics products
Efimenko S., Kovalchuk N., Smolich V.
编号 3 (2023) Specifics of electron-beam microscale processing of substrates made of various types of ceramics
Zhuo Y., Maslovsky V., Moiseev K., Vorobyov I., Nazarenko М.
编号 7 (2025) From the supply of instruments to a joint project currently important for the radio-electronics industry
Editorial T.
编号 6 (2024) From production audit to strategic partnership
Veretsky A.
编号 4 (2025) Domestic GaN Microwave Transistors with a Design Support Kit from «PKK Milandr» JSC and Amplifier Modules Based on Them
Polunin M., Tarasov S., Glushkov G.
编号 10 (2023) Domestic materials and equipment for bare boards – experience exchange and discussion of industry development prospects “RUSCON 2023” science conference of bare boards manufacturers
Kovalevsky Y.
编号 6 (2023) 50–75 GHZ and 75–110 GHZ domestic expansion modules for vector network analyzers
Muravyov V., Zarezin A., Titenko A., Bobova V., Sinogin M., Kukushkin I., Zaostrovnykh S.
编号 9 (2023) Domestic lead-acid batteries for communications infrastructure and electric power industry
Emelianenko S.
编号 7 (2023) Domestic chip resistors adapted to the requirements of the AEC-Q200 standard and environmental directives
Malyshev I., Eremeev Y., Belkov I.
编号 6 (2023) Domestic electronic components and modules for robotics
Starovoitov E., Skiba E.
编号 6 (2025) Cleaning printed circuit boards from flux
Koval Y.
编号 1 (2023) Asset tracking is an element of the Consul system
Skiba E.
编号 2 (2025) Evaluation of 3D Flash Ladar technology capabilities for use in on-board sensors for highly automated vehicles
Starovoytov E., Kondrashov Z., Ignatenko V.
编号 7 (2024) Evaluation of the measurement error of group delay time using a reflectometer
Filippov D., Bakulin A., Zavgorodniy A., Afanasyev M.
编号 2 (2023) Stability and reproducibility evaluation of the technological process of metallization through a removable mask
Pochtar O., Pochtar A.
编号 5 (2025) SAW filters for navigation systems
Izotov V.
编号 5 (2024) Parallel imports and sanctions risks: how to avoid the invasion of «frankensteins»
Zaitsev A.
编号 5 (2024) Passive components from Hottech
Pavlenko A.
编号 2 (2025) Soldering paste. Let’s prepare it correctly!
Kovensky V., Poryadin R.
编号 3 (2024) Advanced connectors from «Elektrodetal» plant
Gurov R., Gorkov A.
编号 10 (2023) Prospects for diamond technologies in russia: What problems need to be solved first
Astafiev A.
编号 4 (2025) Prospects for Virtualization and Multisensorization of Domestic Devices for Measuring Shape Defects
Epifantsev K.
编号 2 (2025) Prospects for the development of a verification framework and standards for multisensor systems
Epifantsev K.
编号 4 (2025) Prospects for The Development of Domestic Cad for Calculating the Main Electrical Parameters of Ferrite Microwave Devices
Skovorodnikov S., Semenov D.
编号 10 (2023) Prospects for diamond technologies in russia: what problems need to be solved first
Skiba E.
编号 1 (2025) Planning the development of the industry and building effective cooperation chains is laborious work on which the future of the country depends
Editorial T.
编号 1 (2024) Plenary part of the “Microelectronics 2023” Russian forum
Kovalevsky Y.
编号 9 (2023) Plenary part of the “Microelectronics 2023” Russian forum. Part 1
Kovalevsky Y.
编号 10 (2023) Plenary part of the “Microelectronics 2023” Russian forum. Part 2
Kovalevsky Y.
编号 10 (2024) Plenary sessions of the “Microelectronics 2024” Russian forum Part 2
Kovalevsky Y.
编号 9 (2024) Plenary Sessions of the “Microelectronics 2024” Russian Forum. Part 1
Kovalevsky Y.
编号 1 (2025) Plenary sessions of the “Microelectronics 2024” Russian forum. Part 3
Kovalevsky Y.
编号 6 (2023) Improving quality of noise suppression in power supply circuits by means of B36 filters
Makhin D., Sizikov A.
编号 2 (2024) Improving the reliability characteristics of multi-lead metal-ceramic packages from ZPP JSC through the use of test systems
Ermilov R., Shugaepov S., Ermolaev E., Egoshin V.
编号 3 (2025) Training personnel for the electronics industry. A view from the Аoundation for advanced research
Zablotsky A.
编号 3 (2025) Support for young scientists as a mechanism for developing new personnel in key areas: the experience of the Foundation for assistance to innovations
Polyakov S.
编号 3 (2025) RSF support contributes to the formation of a new generation of specialists capable of solving strategic problems in the field of microelectronics
Blinov A.
编号 10 (2024) Positive trends and dynamics of electronics development in Russia Round table «Achievements of domestic microelectronics under sanctions. What will we have time to do by ExpoElectronica 2025?»
Mangusheva R., Bolshakov A., Misnichenko N.
编号 3 (2025) Flight controllers for multi-rotor unmanned aerial vehicles
Golubkov A., Melyukov S., Fomichev A.
编号 5 (2023) End-to-end production cycle of microwave products unique on the Russian market Visit to production facility of SDS Electronics
Kovalevsky Y.
编号 7 (2023) End-to-end cycle of creating sensors and signal processing devices: from requirements specifications to serial production
Polevikov V.
编号 2 (2025) Semiconductor manufacturing equipment: steady growth in purchases until 2027
Makushin M.
编号 4 (2023) Semiconductors: sales forecasts and development aspects
Makushin M.
编号 9 (2024) Recent achievements in creating chiplets using bridge interconnects
Sukhanov D.
编号 7 (2024) Creating a digital twin of the production process based on an information and measurement system for indirect vibration control
Yanov E.
编号 6 (2023) Practical aspects of tests for the immunity of equipment to low-frequency conducted interference, carried out according to defense and aviation standards
Smirnov A.
编号 6 (2025) Precision wafer thinning using glass intermediate carrier
Sukhanov D.
编号 6 (2025) Tethered drones and the role of smartpower high-voltage DC/DC converters in ensuring stable power supply
Gaikazyan T.
编号 1 (2023) Application of algorithmic methods in the process of simulation modeling of technological processes
Lijn E., Khomutskaya O., Vantsov S.
编号 10 (2024) Use of domestic deep-calcined alumina for the production of metal-ceramic packages
Egoshin V., Shugaepov S., Akhmetgaliev R., Ermolaev E., Mazurenko A., Chernysheva Y.
编号 5 (2024) Use of russian passive electronic components in automotive industry
Editorial B.
编号 8 (2024) The use of precision methods for electrical testing of metal-ceramic packages
Shugaepov S., Egoshin V., Ermolaev E., Taikov D.
编号 4 (2024) Use of robotics and artificial intelligence in enterprises of military-industrial complex. Meeting of the Military and Industrial Policy and Budget Section of The Expert Council of The Federation Council Committee on Defense And Security
Kovalevsky Y.
编号 5 (2024) Use of Russian Electronic components and measures aimed at stuffing the industry
Kovalevsky Y.
编号 3 (2024) Application of computer vision systems in unmanned aerial vehicles: New opportunities for robotics
Kalinovsky N.
编号 2 (2023) The use of photolithography for the manufacture of metal components at ZPP JSC
Pankratova E., Shugaepov S., Ermolaev E., Egoshin V.
编号 9 (2023) Application of electric motors in robotics and medical equipment
Averichev D.
编号 1 (2024) The use of LETSAR electrical insulating heat-resistant tape in the manufacture of cable
Fedintseva A.
编号 9 (2024) Example of implementation of a single-CYCLE RISC-V processor core using Altera Quartus II Cad
Strogonov A., Vinokurov A., Strogonov A.
编号 9 (2024) Problems of the electronic component base assurance of industrial enterprises and ways of their solution “ECB” the 13th all-Russia science and technology conference
Kasparova E.
编号 4 (2025) Problems of Combined Operation of Onboard Radio Instrument of An Airborne Measuring Station Based on UAV
Starovoytov E., Kondrashov Z., Ignatenko V.
编号 1 (2025) Hardware and software complex for intelligent diagnostics of faults in electronic assembly units
Chuprinova O., Shchenikov Y.
编号 3 (2025) VTR 8.1.0 CAD tools for exploring new FPGA architectures
Strogonov A., Gopenko K., Strogonov A.
编号 7 (2023) Civil products by NIIET JSC: from transistors and microcontrollers to chargers
Maleev V.
编号 3 (2023) Designing finite-state machine in Matlab / Simulink system’s Stateflow tool with subsequent implementation at the FPGA basis
Strogonov А.
编号 9 (2023) Design of monolithic F-class microwave amplifiers
Dudinov K., Zadnepryanaya N.
编号 3 (2025) Being produced under the AKMETECH brand is a privilege that must be earned
Editorial T.
编号 7 (2023) There is a rethinking of the priorities of localization and cooperation in the development of electronics technologies
Pereverzev A.
编号 10 (2024) The professional standard in the field of photonics as a tool for providing the industry with highly qualified personnel
Krupkina T., Kulpinov M., Losev V., Putrya M., Chaplygin Y., Balashov A.
编号 7 (2025) Radio frequency connectors and cables as sources of passive intermodulation in wireless communication systems. Part 1
Dzhurinsky K.
编号 2 (2025) Microwave radioelectronics – moving forward Science and technology conference “RESVCH-2024”. Part 1
Kisсhinsky A., Minnebaev V.
编号 3 (2025) Microwave radioelectronics – moving forward. Science and technology conference “RESVCH-2024”. Part 2
Kishсhinsky A., Minnebaev V.
编号 1 (2025) Deployment of a local navigation system outside the perimeter of the radio navigation reference station network under interference conditions
Korneev I., Kondrashov Z., Korneev A., Kletsov A.
编号 2 (2025) Development of domestic production of passive components for civil industries: challenges, tasks and necessary state support Enlarged meeting of expert board of “passive electronic components” consortium
Kasparova E.
编号 1 (2024) Development of domestic CAD systems for microelectronics design based on the Delta Design platform
Malyshev N.
编号 1 (2024) Development of chemical materials market for microelectronics in Russia: Problems and prospects
Kniga O.
编号 6 (2023) Trassa‑1P 32‑bit universal microcontroller being developed by Angstrem JSC: characteristics and development prospects
Shisharin A.
编号 5 (2023) Development of leadless metal-ceramic packages for wide use in ZPP JSC
Ermilov R., Shugaepov S., Ermolaev Е., Egoshin V.
编号 2 (2024) Development of dielectric heat-conducting film adhesive material for the needs of electronics – domestic experience
Egorov A., Danilov E., Ivanov A., Gurova E., Romanov N., Gareev A., Khripunova Y.
编号 4 (2024) Design and simulation of microwave filter with flip-chip contacts
Skovorodnikov S., Semenov D.
编号 3 (2024) Development of AMR converter mathematical model for implementation in CAD
Cheplakov A., Litvinenko E.
编号 1 (2025) Development of a multi-cycle RISC-V microprocessor core for implementation on the Cyclone V FPGA basis
Strogonov A., Vinokurov A., Strogonov A., Arsentiev A.
编号 6 (2025) Development of domestic software tools for physical design and digital VLSI verification
Sazonov V., Erokhin R., Serov V., Sheblaev M.
编号 5 (2024) Design of an electronic board for a dew point temperature converter
Mihin S., Koshkur O., Ganzha V., Romanov A.
编号 7 (2024) USB Type-C Connectors
Andriyanova M.
编号 1 (2025) Recognition of cardiac signals using neural networks
Dvornikov S., Dvornikov S., Kirshina I., Lifanova O., Tikhonenkova O.
编号 6 (2023) Expanded line of PR1-25 high-power coaxial RF and microwave resistive absorbers
Malyshev I., Eremeev Y., Belkov I.
编号 3 (2023) Real opportunities for import substitution of power electronics
Vorontsov А., Libenko Y., Chetin А.
编号 8 (2024) Reverse growth of pyrolytic ZnO films
Permyakov D., Strogonov A., Nebolsin V., Belykh M.
编号 9 (2023) Results of self-compensation of Mahrform MMQ200 round meter
Epifantsev K.
编号 9 (2023) Robotics in microwave components production: precedent is set
Editorial B.
编号 2 (2023) The market needs domestic line of unified drive solutions with high level of delivery readiness
Gurbashkov M.
编号 3 (2025) Electronics design services market exists in Russia, it is attractive and growing
Editorial T.
编号 7 (2024) Sanctions as an impetus for production modernization
Pydenkov K.
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