| 期 |
标题 |
文件 |
| 编号 3 (224) (2023) |
Designing finite-state machine in Matlab / Simulink system’s Stateflow tool with subsequent implementation at the FPGA basis |
|
|
Strogonov А.
|
| 编号 9 (230) (2023) |
Design of monolithic F-class microwave amplifiers |
|
|
Dudinov K., Zadnepryanaya N.
|
| 编号 7 (228) (2023) |
There is a rethinking of the priorities of localization and cooperation in the development of electronics technologies |
|
|
Pereverzev A.
|
| 编号 1 (232) (2024) |
Development of domestic CAD systems for microelectronics design based on the Delta Design platform |
|
|
Malyshev N.
|
| 编号 1 (232) (2024) |
Development of chemical materials market for microelectronics in Russia: Problems and prospects |
|
|
Kniga O.
|
| 编号 6 (227) (2023) |
Trassa‑1P 32‑bit universal microcontroller being developed by Angstrem JSC: characteristics and development prospects |
|
|
Shisharin A.
|
| 编号 5 (226) (2023) |
Development of leadless metal-ceramic packages for wide use in ZPP JSC |
|
|
Ermilov R., Shugaepov S., Ermolaev Е., Egoshin V.
|
| 编号 2 (233) (2024) |
Development of dielectric heat-conducting film adhesive material for the needs of electronics – domestic experience |
|
|
Egorov A., Danilov E., Ivanov A., Gurova E., Romanov N., Gareev A., Khripunova Y.
|
| 编号 4 (235) (2024) |
Design and simulation of microwave filter with flip-chip contacts |
|
|
Skovorodnikov S., Semenov D.
|
| 编号 3 (234) (2024) |
Development of AMR converter mathematical model for implementation in CAD |
|
|
Cheplakov A., Litvinenko E.
|
| 编号 5 (236) (2024) |
Design of an electronic board for a dew point temperature converter |
|
|
Mihin S., Koshkur O., Ganzha V., Romanov A.
|
| 编号 6 (227) (2023) |
Expanded line of PR1-25 high-power coaxial RF and microwave resistive absorbers |
|
|
Malyshev I., Eremeev Y., Belkov I.
|
| 编号 3 (224) (2023) |
Real opportunities for import substitution of power electronics |
|
|
Vorontsov А., Libenko Y., Chetin А.
|
| 编号 9 (230) (2023) |
Results of self-compensation of Mahrform MMQ200 round meter |
|
|
Epifantsev K.
|
| 编号 9 (230) (2023) |
Robotics in microwave components production: precedent is set |
|
|
Editorial B.
|
| 编号 2 (223) (2023) |
The market needs domestic line of unified drive solutions with high level of delivery readiness |
|
|
Gurbashkov M.
|
| 编号 4 (235) (2024) |
Ultra-short pulse probing signals in near location systems |
|
|
Ivantsov A., Fabrichny M., Fedorov A.
|
| 编号 1 (222) (2023) |
Gallium nitride microwave components: what has changed in two years |
|
|
Kishchinsky A., Minnebaev V.
|
| 编号 3 (234) (2024) |
Microwave ICs for on-board remote sensing equipment and space communication systems. Part 1 |
|
|
Starovoitov E., Skiba E., Nedashkovsky L.
|
| 编号 4 (235) (2024) |
Microwave ICs for on-board remote sensing equipment and space communication systems. Part 2 |
|
|
Starovoitov E., Skiba E., Nedashkovsky L.
|
| 编号 1 (232) (2024) |
Microwave switches controlled via USB, SPI and Ethernet interfaces |
|
|
Kochemasov V.
|
| 编号 7 (228) (2023) |
Today the main task of the state and business is to recreate the electronic engineering industry |
|
|
Alekseev A.
|
| 编号 2 (233) (2024) |
It’s a perfect time for creating production facilities in Russia |
|
|
Avetisyan A.
|
| 编号 5 (226) (2023) |
K10-90 ceramic chip capacitors ranging from 1005M (0402) in size produced in series by Kulon LLC |
|
|
Makhin D., Sizikov А.
|
| 编号 3 (234) (2024) |
The power of cooperation: equipment born in tandem between manufacturer and customer |
|
|
Editorial B.
|
| 编号 5 (226) (2023) |
Weipu and Ruichi power connectors |
|
|
Ezhov V.
|
| 编号 3 (234) (2024) |
Computer vision systems at industrial enterprises |
|
|
Shupov A.
|
| 编号 7 (228) (2023) |
Test systems based on programmable power supplies and electronic loads from APM technologies |
|
|
Fedorov A.
|
| 编号 3 (234) (2024) |
Changing a contractor during 1C:ERP adoption: How to minimize risks |
|
|
Rogozina Y., Kuznetsova E.
|
| 编号 1 (222) (2023) |
Enhancement of legislation for state defense order. Meeting of the military and industrial policy and budget Section of the Expert council of the Federation Council Committee on defense and security |
|
|
Kovalevsky Y.
|
| 编号 2 (233) (2024) |
Enhancement of legislation for price setting of products supplied under the state defense order |
|
|
Kovalevsky Y.
|
| 编号 3 (224) (2023) |
Enhancement of legislation for contract system and procurement procedures |
|
|
Kovalevsky Y.
|
| 编号 7 (228) (2023) |
Modern domestic base of coaxial radio components for microwave modules and units |
|
|
Djurinsky K.
|
| 编号 1 (232) (2024) |
State-of-the-art quartz and rubidium oscillators |
|
|
Ivanov Y.
|
| 编号 3 (234) (2024) |
Current trends in packaging leadless metal-polymer packages |
|
|
Abashin E., Alekhin S., Gavrilin A., Dantsev O.
|
| 编号 4 (225) (2023) |
Current trends in the improvement of magnetic focusing systems |
|
|
Jihad Z., Shvachko A.
|
| 编号 6 (227) (2023) |
Modern business requires a flexible approach and responsiveness |
|
|
Krupenin I.
|
| 编号 5 (226) (2023) |
Connectors for unmanned systems |
|
|
Perminov P.
|
| 编号 5 (236) (2024) |
Design of radio-photonic equipment based on optical and microwave electronics technologies |
|
|
Belkin M., Vasiliev M., Klyushnik D., Kuznetsov E.
|
| 编号 1 (222) (2023) |
Dedicated metal-ceramic packages with integrated and local radiation shields |
|
|
Alontsev A., Grabchikov S.
|
| 编号 7 (228) (2023) |
Electronic identification devices from Angstrem JSC |
|
|
Shisharin A., Davydov A.
|
| 编号 3 (234) (2024) |
Standard components for wide applications from Youtai Semiconductor |
|
|
Sadekov D.
|
| 编号 2 (233) (2024) |
Statistical analysis of the influence of time intervals on the result of measuring the force on the probe of RoundTest RA-120P roundness tester |
|
|
Epifantsev K.
|
| 编号 6 (227) (2023) |
External factors resistance and reliability of metal-ceramic packages |
|
|
Shugaepov S., Ermolaev E., Egoshin V., Sabirova E.
|
| 编号 9 (230) (2023) |
Supercapacitors. Service life and energy density increasing |
|
|
Bogush I., Plugotarenko N., Myasoedova T.
|
| 编号 9 (230) (2023) |
Trends in the production of plastic package ICs |
|
|
Plis N., Rudakov V.
|
| 编号 1 (232) (2024) |
Technological advances give us the opportunity to move forward confidently |
|
|
Fomenko I.
|
| 编号 2 (233) (2024) |
X-ray inspection technology |
|
|
Aleinikov P.
|
| 编号 5 (226) (2023) |
Three-gap multifrequency resonator for miniature Multibeam klystrons |
|
|
Miroshnichenko А., Chernyshev М., Akafyeva N.
|
| 编号 6 (227) (2023) |
Difficulties in implementing the chips act in the US |
|
|
Avdonin B., Makushin M.
|
| 编号 6 (227) (2023) |
Deepening self-diagnosis of test and verification equipment of control systems: migration from Windows to Linux |
|
|
Belov S.
|
| 编号 9 (230) (2023) |
You can strengthen your position in the civilian market by maximizing the range of products produced |
|
|
Romanov V.
|
| 编号 8 (229) (2023) |
Universal automatic battery testing system |
|
|
Chebanov A., Shostak A.
|
| 编号 7 (228) (2023) |
Contacting devices and carriers from ZPP JSC for IC testing |
|
|
Shugaepov S., Ermolaev E., Egoshin V., Magidov E.
|
| 编号 1 (232) (2024) |
UV-curable adhesive elad UF-50 with ultra-low shrinkage for mounting optical elements |
|
|
Antipova E., Spiridonova A., Korotkova N., Gladkikh S.
|
| 编号 1 (232) (2024) |
Solius FG-018 flux-gel: What do Russian specialists solder with |
|
|
Potseluev D.
|
| 编号 1 (232) (2024) |
Formulation of Russian passive electronic components road map |
|
|
Kovalevsky Y.
|
| 编号 2 (233) (2024) |
Generating and studying amplitude-frequency modulation signals using Rigol devices |
|
|
Lemeshko N., Gorelkin M.
|
| 编号 10 (231) (2023) |
Formation of a data package of coordinate measurements in shape, contour, location control tools |
|
|
Epifantsev K.
|
| 编号 6 (227) (2023) |
Photopiezoelectric receiver of optical signals based on surface acoustic waves |
|
|
Mitrokhin V., Strogonov A., Gurov A., Lyalin D.
|
| 编号 2 (223) (2023) |
Characteristics of silicon cantilevers for atomic force microscopy from Angstrem JSC |
|
|
Novak A., Sokolov A., Kovalev V.
|
| 编号 8 (229) (2023) |
Chiplets and heterogeneous integration as a basic technology stack capable of ensuring the sovereignty of domestic electronics in a new technological order |
|
|
Achkasov A.
|
| 编号 7 (228) (2023) |
In order to keep up with events, you need to get ahead of them |
|
|
Chikvarkin I.
|
| 编号 6 (227) (2023) |
Miracles don’t happen. But many still hope on them |
|
|
Vasilenko A.
|
| 编号 3 (234) (2024) |
Wide range of equipment for surface mounting from SmtMaks at ExpoElectronica-2024 |
|
|
Maslov A.
|
| 编号 8 (229) (2023) |
Electronic components for rocket and space industry and not only that. “ECB-2023” the 12th All-Russia Science and Technology Conference |
|
|
Kovalevsky Y.
|
| 编号 10 (231) (2023) |
Electric motors in the automotive industry |
|
|
Averichev D., Berezina Y.
|
| 编号 3 (234) (2024) |
Electric motors for domestic robotics and unmanned vehicles |
|
|
Dudorov E., Kuvshinov D.
|
| 编号 2 (223) (2023) |
Electrolytic anodizing of silicon, silicon carbide and silicon nitride for nanotechnology purposes (review) |
|
|
Makharinets A., Mileshko L.
|
| 编号 9 (230) (2023) |
Electromechanical components from ZPP JSC |
|
|
Rybakov D.
|
| 编号 3 (234) (2024) |
Electronic components from JSC «Zavod Rekond» |
|
|
Smirnovsky S., Andzhanovskaya Y.
|
| 编号 7 (228) (2023) |
Electro-optical properties of polymer-dispersed liquid crystals doped with nanoparticles |
|
|
Belyaev V., Avdeenkov V.
|
| 编号 10 (231) (2023) |
An effective personnel strategy is a prerequisite for the leadership of «NIIME» JSC |
|
|
Polikarpova L., Sadkova N.
|
| 编号 1 (232) (2024) |
An effective approach to designing a control machines for microprocessor cores |
|
|
Strogonov A., Bordyuzha O., Strogonov A.
|
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