Мақалалар тізімі

Шығарылым Атауы Файл
№ 3 (234) (2024) 60 years in microelectronics
Kovalevsky Y.
№ 2 (223) (2023) CHIPS Act and some aspects of improving the US R&D ecosystem
Avdonin B., Makushin M.
№ 3 (234) (2024) FLEX after a lapse of a year and a half: Practice confirms the demand for solutions for the rapid building of balanced production facilities
Lipkin E., Gogin O.
№ 2 (223) (2023) LDMOS: the new products by NIIET JSC
Alekseev R., Semeykin I., Tsotsorin A., Kurshev P.
№ 2 (233) (2024) SETsafe | SETfuse: 24 years of development and production of electrical circuit protection components
Trubachev B.
№ 3 (224) (2023) Zestron has gone… Hydronol will continue working!
Kovensky V., Poceluev D.
№ 2 (233) (2024) ChemSonic are new generation ultrasonic baths
Koval Y.
№ 2 (223) (2023) Algorithm for introducing compensation coefficients at out-of-round gage
Epifantsev E.
№ 4 (225) (2023) Electronic quality diamond. Innovation. Investments. Creative projects
Luchinin V., Kolyadin A., Yagudaev Y., Ilyin S.
№ 4 (225) (2023) Analysis of promising areas for creation an innovative business in Russian Federation
Levalds Y.
№ 10 (231) (2023) Analysis of contour and shape measurement results from multiple references during calibration
Epifantsev K.
№ 1 (222) (2023) DC analysis of electrical circuits by the Newton - Raphson method
Strogonov A.
№ 3 (224) (2023) SK4-MAX6 signal and spectrum analyzer – made in Russia
Timonovich А.
№ 1 (222) (2023) Antenna switches. Part 5
Kochemasov V., Safin A., Dinges S.
№ 2 (223) (2023) Antenna switches. Part 6
Kochemasov V., Safin A., Dinges S.
№ 10 (231) (2023) Chasing excellence: from deep machine learning to artificial intelligence in maker- ray aoi systems. Part 1
Rozhkov I., Garanin A., Podolsky D.
№ 3 (234) (2024) Chasing excellence: from deep machine learning to artificial intelligence in Maker-Ray AOI systems. Part 2
Rozhkov I., Garanin A., Podolsky D.
№ 1 (222) (2023) The priority is to implement new competitive technologies
Buynevich A.
№ 3 (234) (2024) In today’s world, navigation and communication will be inviolable factors in technological advantage and independence of the country
Kondrashov Z.
№ 2 (233) (2024) In the current conditions, one needs to permanently be at the ready
Kutsko P.
№ 2 (223) (2023) Microbolometers vacuum packaging
Vidritsky A., Lanin V.
№ 2 (233) (2024) Possibility of using non-contact sensors to measure shape defects
Epifantsev K.
№ 10 (231) (2023) Waveguide microwave switches
Kochemasov V.
№ 3 (234) (2024) Fiber-optic gyroscopes and systems based on them. Part 1
Berezina Y.
№ 3 (224) (2023) Remembering the future: parts warehouse automation
Rozhkov I., Garanin А., Podolsky D.
№ 7 (228) (2023) High quality capacitors from Jinpei Electronics
Sokolov M.
№ 10 (231) (2023) It is not easy to find top experts. But it is possible to raise them
Ryabokul A.
№ 3 (234) (2024) PCB high speed differential pairs for modular connector
Shalomanov V., Bakanin D.
№ 2 (223) (2023) Globalization and monopolization of microelectronics in current conditions
Shelepin N.
№ 3 (224) (2023) There is very good prospect for components producers, and we must use this opportunity
Sizikov A.
№ 7 (228) (2023) Development requires close interaction between component manufacturers, product developers and end users, and government
Gurbashkov M.
№ 4 (225) (2023) Available inductive components on the Russian market
Krupnov I.
№ 1 (222) (2023) Changes to the All-Russian Product Classification regarding radio-electronic products
Editorial B.
№ 4 (225) (2023) Measuring shape defects with quaternion geometric transformation algorithms
Epifantsev K.
№ 7 (228) (2023) Import substitution in the field of production equipment: solutions from PROTECH
Koval Y.
№ 4 (225) (2023) Intelligent navigation of unmanned agricultural machinery
Starovoitov E., Skiba E.
№ 3 (234) (2024) Artificial intelligence as a tool of improving the production process at «ZPP» JSC
Pozdeev V., Shugaepov S., Ermolaev E., Egoshin V.
№ 10 (231) (2023) Use of artificial intelligence and computer simulation in the field of superconductivity
Abdyukhanov I., Terina M., Savelyev I., Tsapleva A., Alekseev M.
№ 2 (233) (2024) Electromagnetic compatibility tests
Gusev I., Faizullaev V.
№ 7 (228) (2023) Electromagnetic compatibility test
Grishin D.
№ 2 (223) (2023) TESTPRIBOR JSC test center: how to guarantee reliability
Shekhovtsova E.
№ 2 (223) (2023) Investigation of the operation algorithm of the out-of-round gage centering system
Epifantsev K.
№ 7 (228) (2023) Study of memristor structures based on copper and tin oxides
Permyakov D., Strogonov A.
№ 3 (224) (2023) History of RF connectors. Instrument and metrology connectors
Djurinsky К.
№ 1 (222) (2023) History of rf connectors. general purpose connectors. Part 1
Djurinsky K.
№ 2 (223) (2023) History of rf connectors. General purpose connectors. Part 2
Djurinsky K.
№ 2 (233) (2024) Adjustable voltage output dc power supplies
Vorontsov A.
№ 10 (231) (2023) Personnel policy of ZPP JSC
Razumova E.
№ 1 (232) (2024) Human capital in the field of microwave measurement: demands and ways to meet them
Kovalevsky Y.
№ 10 (231) (2023) Human capital in the field of microwave measurement: demands and ways to meet them. Part 1
Kovalevsky Y.
№ 4 (225) (2023) How do we develop domestic microelectronics: 2023
Enns V.
№ 3 (224) (2023) How to defeat the dragon: implementation of 1C:ERP in the contract manufacturing of electronics using the Agile methodology
Rogozina Y., Kuznetsova E.
№ 4 (225) (2023) How to correctly choose and optimally apply vector network analysers. “Fundamentals of measurement” workshop
Kovalevsky Y.
№ 3 (234) (2024) How to create a clean production room. Technologies and equipment
Usatov A., Lyakhov P.
№ 4 (225) (2023) Corebai Microelectronics Chinese semiconductor developer: product overview
Sadekov D.
№ 3 (234) (2024) The key challenge for the robotics industry is to build close cooperation
Gurbashkov M.
№ 3 (234) (2024) KingTech is a new expert in the field of TFT LCD display production
Pavlenko A.
№ 3 (224) (2023) X Electronics is open to constructive and mutually beneficial cooperation
Paevsky V.
№ 3 (224) (2023) A comprehensive solution for materials mixing and dispensing Visit to “Weltplast” and NTF “Techno-Alijans Elektroniks”
Kovalevsky Y.
№ 3 (234) (2024) Computer modules: application advantages and popular standards as exemplified by NPK «ATRONIK» products
Medvedev A.
№ 3 (234) (2024) Contact devices for testing electronic components are reliable solutions from «IC Socket»
Kapshunova Y., Kolochkov S.
№ 1 (222) (2023) Contract manufacturing service at ZPP JSC, its risks and benefits
Shakirova E., Shugaepov S., Ermolaev E., Egoshin V.
№ 1 (222) (2023) Contract manufacturing of iсs. The world's leading silicon fabs increase capacities
Makushin M.
№ 1 (232) (2024) Smart concept: how to build world-class production facilities in Russia
Zavalko A.
№ 10 (231) (2023) Coordination center “staffing support for microelectronics”: tasks, functions, planned results
Pereverzev A., Balashov A., Kozlov A.
№ 1 (222) (2023) Large-scale opportunities: the specifics of the Russian assembly service for consumer electronics - realities and market potential
Lishik S.
№ 3 (224) (2023) Navigation and telematics module line. LTE wireless modules
Chikvarkin I.
№ 7 (228) (2023) Line of telematics modules: achievements and development prospects
Chikvarkin I.
№ 2 (233) (2024) ExpoElectronica 2024 international exhibition – new sections, new companies, new opportunities for participants and visitors
Mangusheva R.
№ 2 (223) (2023) ExpoElectronica 2023 international anniversary exhibition – new sections, new opportunities for exhibitors and visitors
Mangusheva R.
№ 4 (225) (2023) Business program events of ExpoElectronica 2023. Part 1
Kovalevsky Y.
№ 2 (233) (2024) Methodology for calculating the thermal conductivity coefficient of composite materials
Tsionenko D., Kozlovsky I.
№ 2 (233) (2024) Passive polyphase filters design methodology
Nedashkovsky L., Repin V.
№ 2 (233) (2024) Methods for predicting ic durability based on parametric failures
Strogonov A.
№ 3 (224) (2023) Si-OLED microdisplays from Top Display Optoelectronics
Pavlenko А.
№ 3 (224) (2023) Microelectronics: development of the production facilities, sales of equipment and EUV lithography
Makushin М.
№ 1 (232) (2024) Minifabs in microelectronics: History and opportunities
Khisamov A., Nazarenko A.
№ 3 (234) (2024) Simulating a solar cell with a regular surface texture using technology level CAD
Plotnikova E., Arsentiev A., Vinokurov A.
№ 7 (228) (2023) Simulation of electronic devices with regard to the stochastic characteristics of their components
Legan Y.
№ 3 (234) (2024) KHARZA® modular drive is a new approach to solving problems
Gurbashkov M.
№ 3 (224) (2023) R1-150M power resistors and HP1-82 resistor sets for use in power electronic modules
Malyshev I., Eremeev Y., Mozulyakina Е.
№ 7 (228) (2023) We are ready to offer non-standard solutions
Kapshunova Y.
№ 3 (224) (2023) We come to the customers not with a component, but with a solution to their problem
Semyonov D.
№ 3 (234) (2024) We successfully got through a hard period thanks to diversification of supplies
Dedyukhin A.
№ 3 (224) (2023) We want to become a company the russian customers trust the most
Helmi F.
№ 2 (223) (2023) Navigation in the city by stationary radio sources
Starovoitov E., Skiba E.
№ 1 (232) (2024) Navigation in medical institutions: State-of-the-art technologies
Starovoitov E., Skiba E.
№ 10 (231) (2023) Reliability and security of operating systems of various architectures. Part 3
Nazarov S., Barsukov A.
№ 1 (222) (2023) It is exciting for us to dream and achieve dreams, discover new markets
Yurov V.
№ 2 (223) (2023) Bench-top automatic machine for gold wire mounting by ball-wedge method
Petukhov I., Letunovich E.
№ 4 (225) (2023) Our customers receive the equipment not from a catalog, but exactly that they need
Musaev S.
№ 3 (224) (2023) Our goal is to expand the range of domesticproducts and increase market share
Myakochin Y.
№ 4 (225) (2023) New generation neutron spectrometer-dosimeter
Rudnev P., Cheshigin I.
№ 2 (223) (2023) New from Thinking Electronic: KRV series combined overvoltage and overcurrent protection devices
Korotkov M.
№ 7 (228) (2023) New display products from Raystar
Pavlenko A.
№ 7 (228) (2023) Move of industrial furniture and test equipment production is another step towards its expansion and increase in efficiency
Kovalevsky Y.
№ 1 (222) (2023) New opportunities for contract design and manufacturing services: how they arise and how to take advantage of them
Tishkin S., Moskovko I.
№ 4 (225) (2023) New metal-ceramic packages from ZPP JSC
Shugaepov S., Ermolaev E., Egoshin V., Loskutova A., Sabirova E.
№ 3 (234) (2024) New products will increase our competitive advantage in the civilian market
Sizikov A., Makhin D.
№ 3 (234) (2024) The next level of production means not only its expansion, but also a significant increase in product quality
Ulyanov S.
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